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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
0475940002

0475940002

CONN SOCKET LGA 1366POS GOLD

Molex

2660 0.00
- +

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0475940002

Datenblatt

Tray 47594 Obsolete LGA 1366 (32 x 41) 0.040 (1.02mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.040 (1.01mm) - - - Liquid Crystal Polymer (LCP)
0475943001

0475943001

CONN SOCKET LGA 1356POS GOLD

Molex

2198 0.00
- +

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0475943001

Datenblatt

Tray 47594 Obsolete LGA 1356 (32 x 41) 0.040 (1.02mm) Gold 15.0µin (0.38µm) - Surface Mount Open Frame - - - - - -
0475960132

0475960132

CONN SOCKET LGA 1156POS GOLD

Molex

3009 0.00
- +

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0475960132

Datenblatt

Tray 47596 Obsolete LGA 1156 (40 x 40) 0.036 (0.91mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.036 (0.91mm) - - - Thermoplastic
0475960232

0475960232

CONN SOCKET LGA 1155POS GOLD

Molex

2454 0.00
- +

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0475960232

Datenblatt

Tray 47596 Obsolete LGA 1155 (40 x 40) 0.036 (0.91mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.036 (0.91mm) - - - Thermoplastic
0475960233

0475960233

CONN SOCKET LGA 1155POS GOLD

Molex

3243 0.00
- +

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0475960233

Datenblatt

Tray 47596 Obsolete LGA 1155 (40 x 40) 0.036 (0.91mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.036 (0.91mm) - - - Thermoplastic
SA649000

SA649000

CONN IC DIP SOCKET 64POS GOLD

On Shore Technology Inc.

2853 0.00
- +

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SA649000

Datenblatt

Tube SA Obsolete DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Thermoplastic, Polyester, Glass Filled
SA649040

SA649040

CONN IC DIP SOCKET 64POS GOLD

On Shore Technology Inc.

2536 0.00
- +

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SA649040

Datenblatt

Tube SA Obsolete DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 80.0µin (2.03µm) Brass Thermoplastic, Polyester, Glass Filled
ICO-314-M-TT

ICO-314-M-TT

CONN IC DIP SOCKET 14POS TIN

Samtec Inc.

2120 0.00
- +

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ICO-314-M-TT

Datenblatt

Bulk ICO Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
ICO-316-M-TT

ICO-316-M-TT

CONN IC DIP SOCKET 16POS TIN

Samtec Inc.

2991 0.00
- +

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ICO-316-M-TT

Datenblatt

Bulk ICO Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
232-1270-51-0602

232-1270-51-0602

STAGGERED ZIP STRIP POCKETS 32 C

3M

2597 0.00
- +

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- Textool™ Active - - - - - - - - - - - - - -
232-1270-52-0602

232-1270-52-0602

STAGGERED ZIP STRIP POCKETS 32 C

3M

2012 0.00
- +

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- Textool™ Active - - - - - - - - - - - - - -
232-1271-00-1102JH

232-1271-00-1102JH

OEM LCC SOCKETS 32 POS SOLID LID

3M

2267 0.00
- +

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232-1271-00-1102JH

Datenblatt

- OEM Obsolete - - - - - - - - - - - - - -
234-3034-51-0602

234-3034-51-0602

CONN ZIG-ZAG ZIF 34POS GOLD

3M

3300 0.00
- +

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Bulk Textool™ Active Zig-Zag, ZIF (ZIP) 34 (2 x 17) 0.050 (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
234-3034-52-0602

234-3034-52-0602

CONN ZIG-ZAG ZIF 34POS GOLD

3M

3697 0.00
- +

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Bulk Textool™ Active Zig-Zag, ZIF (ZIP) 34 (2 x 17) 0.050 (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
235-3019-51-0602

235-3019-51-0602

CONN ZIG-ZAG ZIF 35POS GOLD

3M

2586 0.00
- +

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Bulk Textool™ Active Zig-Zag, ZIF (ZIP) 35 (1 x 17, 1 x 18) 0.050 (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
235-3019-52-0602

235-3019-52-0602

CONN ZIG-ZAG ZIF 35POS GOLD

3M

3841 0.00
- +

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Bulk Textool™ Active Zig-Zag, ZIF (ZIP) 35 (1 x 17, 1 x 18) 0.050 (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
236-6225-50-0602

236-6225-50-0602

SOCKET ZIP IN-LINE 36POS

3M

3445 0.00
- +

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Немедленный

Box - Active - - - - - - - - - - - - - -
239-5605-51-0602

239-5605-51-0602

CONN SOCKET 39POS ZIP STRIP

3M

3702 0.00
- +

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Немедленный

- - Active - - - - - - - - - - - - - -
239-5605-52-0602

239-5605-52-0602

CONN SOCKET 39POS ZIP STRIP

3M

2175 0.00
- +

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Немедленный

- - Active - - - - - - - - - - - - - -
251-5949-51-0602

251-5949-51-0602

CONN ZIG-ZAG ZIF 51POS GOLD

3M

3771 0.00
- +

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Немедленный

Bulk Textool™ Active Zig-Zag, ZIF (ZIP) 51 (1 x 25, 1 x 26) 0.050 (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
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