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| Фотографии | Производитель. Часть # | Акции | Цены | А | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
1571539-1CONN SOCKET PLCC 20POS TIN |
3958 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Bulk | - | Obsolete | PLCC | 20 (4 x 5) | 0.100 (2.54mm) | Tin | 180.0µin (4.57µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 180.0µin (4.57µm) | Copper Alloy | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
1-822473-1CONN SOCKET PLCC 20POS TIN |
3432 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tube | - | Obsolete | PLCC | 20 (4 x 5) | 0.050 (1.27mm) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | Thermoplastic |
|
A32-LCG-T-RCONN IC DIP SOCKET 32POS GOLD |
3282 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tube | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | - | - | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | - | - | Polybutylene Terephthalate (PBT), Glass Filled |
|
A48-LCG-T-RCONN IC DIP SOCKET 48POS GOLD |
2117 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tube | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | - | - | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | - | - | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
1-382568-6CONN IC DIP SOCKET 16POS TIN |
2738 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Box | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
|
2-382568-5CONN IC DIP SOCKET 24POS TIN |
3338 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Box | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
|
2-382713-1CONN IC DIP SOCKET 18POS TIN |
2476 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Box | Diplomate DL | Active | DIP, 0.6 (15.24mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
|
2-382713-3CONN IC DIP SOCKET 18POS TIN |
2364 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Box | Diplomate DL | Active | DIP, 0.6 (15.24mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
|
2-382713-6CONN IC DIP SOCKET 18POS TIN |
2396 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Box | Diplomate DL | Active | DIP, 0.6 (15.24mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
|
2-382713-8CONN IC DIP SOCKET 18POS TIN |
2885 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Box | Diplomate DL | Active | DIP, 0.6 (15.24mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
|
2-382718-3CONN IC DIP SOCKET 28POS TIN |
3236 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Box | Diplomate DL | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
|
2-382718-8CONN IC DIP SOCKET 28POS TIN |
3528 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Box | Diplomate DL | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
|
2-382724-1CONN IC DIP SOCKET 40POS TIN |
3932 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Box | Diplomate DL | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
|
2-382724-3CONN IC DIP SOCKET 40POS TIN |
3076 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Box | Diplomate DL | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
|
2-382724-6CONN IC DIP SOCKET 40POS TIN |
3584 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Box | Diplomate DL | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
|
2-382882-1CONN IC DIP SOCKET 6POS TIN |
2693 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Box | Diplomate DL | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
|
641855-1CONN IC DIP SOCKET 24POS TIN |
2713 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Box | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic |
|
|
5-1437529-9CONN IC DIP SOCKET 4POS GOLD |
3484 | 0.00 |
ДобавитьНемедленный |
Tube | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Thermoplastic, Polyester | |
|
522-AG10DCONN IC DIP SOCKET 22POS GOLD |
3282 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Copper Alloy | - |
|
|
7-1437532-6CONN IC DIP SOCKET 40POS GOLD |
3959 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tube | 500 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Polyester |
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