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| Фотографии | Производитель. Часть # | Акции | Цены | А | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SIP1X16-041BLFCONN SOCKET SIP 16POS GOLD |
3937 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Bulk | SIP1x | Obsolete | SIP | 16 (1 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
DPF316-998ZCONN IC DIP SOCKET 16POS TINLEAD |
2766 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Bag | DPF3 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
DPF314-998ZCONN IC DIP SOCKET 14POS TINLEAD |
2020 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Bag | DPF3 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
DPF308-998ZCONN IC DIP SOCKET 8POS TIN-LEAD |
3799 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Bag | DPF3 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
SIP1X02-041BLFCONN SOCKET SIP 2POS GOLD |
2938 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Bulk | SIP1x | Obsolete | SIP | 2 (1 x 2) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
1-1747890-1CONN SOCKET LGA 771POS GOLD |
3291 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tray | - | Obsolete | LGA | 771 (33 x 33) | 0.043 (1.09mm) | Gold | - | Copper Alloy | Surface Mount | Open Frame | Solder | 0.043 (1.09mm) | - | - | - | Thermoplastic |
|
1735315-4CONN SOCKET PGA ZIF 939POS GOLD |
3642 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tray | - | Obsolete | PGA, ZIF (ZIP) | 939 (31 x 31) | 0.050 (1.27mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic |
|
1871554-1CONN SKT 1207-F RIGHT LEVER SMD |
2621 | 39.54 |
ДобавитьНемедленный |
Datenblatt |
Bulk | - | Obsolete | LGA | 1207 (33 x 34) | 0.043 (1.09mm) | Gold | - | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.043 (1.09mm) | Gold | - | Copper Alloy | Thermoplastic |
|
1761503-1CONN SOCKET PGA 940POS GOLD |
2337 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tray | - | Active | PGA | 940 (30 x 30) | 0.050 (1.27mm) | Gold | 30.0µin (0.76µm) | - | Surface Mount | Closed Frame | - | - | - | - | - | - |
|
|
1-1903401-4CONN SOCKET PGA 638POS GOLD |
2759 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tape & Reel (TR),Cut Tape (CT) | - | Obsolete | PGA | 638 (26 x 26) | 0.050 (1.27mm) | Gold | Flash | Copper Alloy | Surface Mount | Open Frame | Solder | 0.050 (1.27mm) | Gold | - | Copper Alloy | Thermoplastic |
|
1674770-6CONN SOCKET PGA ZIF 479POS GOLD |
2783 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tape & Reel (TR),Cut Tape (CT) | - | Obsolete | PGA, ZIF (ZIP) | 479 (26 x 26) | 0.050 (1.27mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.050 (1.27mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic |
|
|
8180-E1CONN TRANSIST TO-3 4POS TIN |
3640 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 8180 | Active | Transistor, TO-3 | 4 (Oval) | - | Tin | - | Steel | Through Hole | Closed Frame | Solder | - | Tin | - | Steel | Polyamide (PA), Nylon, Glass Filled |
|
A28-LC-7-TT-RCONN IC DIP SOCKET 28POS TIN |
3849 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Box | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT) |
|
|
MHAS-181-ZMGG-15CONN SOCKET BGA 181POS GOLD |
2327 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Bulk | MHA | Obsolete | BGA | 181 (15 x 15) | 0.100 (2.54mm) | Gold | - | - | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | - | - | - |
|
|
100-006-050CONN IC DIP SOCKET 6POS GOLD |
2086 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
100-008-050CONN IC DIP SOCKET 8POS GOLD |
3451 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
100-008-051CONN IC DIP SOCKET 8POS GOLD |
2994 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
100-010-050CONN IC DIP SOCKET 10POS GOLD |
2619 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
100-014-050CONN IC DIP SOCKET 14POS GOLD |
2112 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
100-014-051CONN IC DIP SOCKET 14POS GOLD |
2703 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
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