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| Фотографии | Производитель. Часть # | Акции | Цены | А | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
2-641615-3CONN IC DIP SOCKET 28POS TIN |
2153 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
2-641261-1CONN IC DIP SOCKET 14POS TIN |
2437 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
2-641260-1CONN IC DIP SOCKET 8POS TIN |
3729 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
|
2-641260-4CONN IC DIP SOCKET 8POS GOLD |
3331 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled |
|
2-641262-1CONN IC DIP SOCKET 16POS TIN |
3469 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
2-640464-2CONN IC DIP SOCKET 20POS GOLD |
3353 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
2-641267-1CONN IC DIP SOCKET 28POS TIN |
2356 | 0.76 |
ДобавитьНемедленный |
Datenblatt |
Tube,Box | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
AR28-HZL/01-TTCONN IC DIP SOCKET 28POS GOLD |
3721 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Bag | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
|
AR28-HZL/7/01-TTCONN IC DIP SOCKET 28POS GOLD |
3539 | 0.00 |
ДобавитьНемедленный |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | |
|
AR32-HZL/01-TTCONN IC DIP SOCKET 32POS GOLD |
2532 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Bag | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR40-HZL/01-TTCONN IC DIP SOCKET 40POS GOLD |
2041 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Bag | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
2-640362-2CONN IC DIP SOCKET 28POS GOLD |
2610 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled |
|
2-640358-2CONN IC DIP SOCKET 16POS GOLD |
2928 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled |
|
|
2-640361-2CONN IC DIP SOCKET 24POS GOLD |
2810 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic |
|
|
2-640379-2CONN IC DIP SOCKET 40POS GOLD |
3268 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tube | Diplomate DL | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled |
|
|
2-640463-2CONN IC DIP SOCKET 8POS GOLD |
3906 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled |
|
2-641267-3CONN IC DIP SOCKET 28POS TIN |
3730 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
2-641615-1CONN IC DIP SOCKET 28POS TIN |
2929 | 0.80 |
ДобавитьНемедленный |
Datenblatt |
Tube,Box | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole, Right Angle, Vertical | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
2-641606-2CONN IC DIP SOCKET 40POS GOLD |
3455 | 3.16 |
ДобавитьНемедленный |
Datenblatt |
Tube,Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled |
|
2-641609-1CONN IC DIP SOCKET 14POS TIN |
2490 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
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