Sockets for ICs, Transistors - Element(Гонконг) Technology Co., Ltd.

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Производитель. Часть #	Акции	Цены	А	Таблицы данных	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
510-91-085-10-031003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3657	24.88	- + Добавить Немедленный	Datenblatt	Bulk	510	Active	PGA	85 (10 x 10)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-085-13-042002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2690	24.88	- + Добавить Немедленный	Datenblatt	Bulk	510	Active	PGA	85 (13 x 13)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-085-13-042003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2478	24.88	- + Добавить Немедленный	Datenblatt	Bulk	510	Active	PGA	85 (13 x 13)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-085-13-081002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2323	24.88	- + Добавить Немедленный	Datenblatt	Bulk	510	Active	PGA	85 (13 x 13)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-085-13-081003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2178	24.88	- + Добавить Немедленный	Datenblatt	Bulk	510	Active	PGA	85 (13 x 13)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-13-964-41-001000 CONN IC DIP SOCKET 64POS GOLD Mill-Max Manufacturing Corp.	3921	24.89	- + Добавить Немедленный	Datenblatt	Tube	121	Active	DIP, 0.9 (22.86mm) Row Spacing	64 (2 x 32)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-328-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3071	24.90	- + Добавить Немедленный		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
116-43-428-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3593	24.90	- + Добавить Немедленный		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
116-43-628-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2753	24.90	- + Добавить Немедленный		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
116-93-328-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2983	24.90	- + Добавить Немедленный		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
116-93-428-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2658	24.90	- + Добавить Немедленный		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
116-93-628-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2342	24.90	- + Добавить Немедленный		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
48-6508-20 CONN IC DIP SOCKET 48POS GOLD Aries Electronics	3734	24.91	- + Добавить Немедленный	Datenblatt	Bulk	508	Active	DIP, 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
48-6508-30 CONN IC DIP SOCKET 48POS GOLD Aries Electronics	3647	24.91	- + Добавить Немедленный	Datenblatt	Bulk	508	Active	DIP, 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
34-0508-21 CONN SOCKET SIP 34POS GOLD Aries Electronics	3030	24.95	- + Добавить Немедленный	Datenblatt	Bulk	508	Active	SIP	34 (1 x 34)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6
34-0508-31 CONN SOCKET SIP 34POS GOLD Aries Electronics	2210	24.95	- + Добавить Немедленный	Datenblatt	Bulk	508	Active	SIP	34 (1 x 34)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6
518-77-192M16-001105 CONN SOCKET PGA 192POS GOLD Preci-Dip	3958	23.41	- + Добавить Немедленный	Datenblatt	Bulk	518	Active	PGA	192 (16 x 16)	0.050 (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.050 (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass
34-1508-21 CONN IC DIP SOCKET 34POS GOLD Aries Electronics	3163	24.96	- + Добавить Немедленный	Datenblatt	Bulk	508	Active	DIP, 0.2 (5.08mm) Row Spacing	34 (2 x 17)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6
34-1508-31 CONN IC DIP SOCKET 34POS GOLD Aries Electronics	3939	24.96	- + Добавить Немедленный	Datenblatt	Bulk	508	Active	DIP, 0.2 (5.08mm) Row Spacing	34 (2 x 17)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6
110-13-648-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2209	24.97	- + Добавить Немедленный		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-