Sockets for ICs, Transistors - Element(Гонконг) Technology Co., Ltd.

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Производитель. Часть #	Акции	Цены	А	Таблицы данных	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
116-93-628-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2025	24.03	- + Добавить Немедленный		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
48-6820-90C CONN IC DIP SOCKET 48POS GOLD Aries Electronics	2933	24.03	- + Добавить Немедленный	Datenblatt	Bulk	Vertisockets™ 800	Active	DIP, 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
48-6822-90C CONN IC DIP SOCKET 48POS GOLD Aries Electronics	2588	24.03	- + Добавить Немедленный	Datenblatt	Bulk	Vertisockets™ 800	Active	DIP, 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
48-6823-90C CONN IC DIP SOCKET 48POS GOLD Aries Electronics	2143	24.03	- + Добавить Немедленный	Datenblatt	Bulk	Vertisockets™ 800	Active	DIP, 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
510-91-064-10-051001 SOCKET SOLDERTAIL 64-PGA Mill-Max Manufacturing Corp.	2950	24.03	- + Добавить Немедленный		Bulk	510	Active	PGA	64 (10 x 10)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-064-08-000001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2320	24.03	- + Добавить Немедленный	Datenblatt	Bulk	510	Active	PGA	64 (8 x 8)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-064-08-000002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2753	24.03	- + Добавить Немедленный	Datenblatt	Bulk	510	Active	PGA	64 (8 x 8)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-064-08-000003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2802	24.03	- + Добавить Немедленный	Datenblatt	Bulk	510	Active	PGA	64 (8 x 8)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-064-10-051002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3754	24.03	- + Добавить Немедленный	Datenblatt	Bulk	510	Active	PGA	64 (10 x 10)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-064-10-051003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2363	24.03	- + Добавить Немедленный	Datenblatt	Bulk	510	Active	PGA	64 (10 x 10)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-432-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2553	24.04	- + Добавить Немедленный		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
116-43-632-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3677	24.04	- + Добавить Немедленный		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
116-93-432-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2727	24.04	- + Добавить Немедленный		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
116-93-632-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2601	24.04	- + Добавить Немедленный		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
546-83-223-18-091135 CONN SOCKET PGA 223POS GOLD Preci-Dip	2826	22.62	- + Добавить Немедленный	Datenblatt	Bulk	546	Active	PGA	223 (18 x 18)	0.050 (1.27mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100 (2.54mm)	Tin	-	Bronze	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-83-223-18-091136 CONN SOCKET PGA 223POS GOLD Preci-Dip	2326	22.62	- + Добавить Немедленный	Datenblatt	Bulk	546	Active	PGA	223 (18 x 18)	0.050 (1.27mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100 (2.54mm)	Tin	-	Bronze	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-13-316-61-801000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3152	24.06	- + Добавить Немедленный		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
40-6621-30 CONN IC DIP SOCKET 40POS TIN Aries Electronics	2784	24.07	- + Добавить Немедленный	Datenblatt	Bulk	6621	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole, Bottom Entry; Through Board	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
110-13-320-61-801000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2461	24.10	- + Добавить Немедленный		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
111-43-650-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3953	24.11	- + Добавить Немедленный		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-