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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
126-41-648-41-003000

126-41-648-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3886 20.86
- +

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Немедленный

126-41-648-41-003000

Datenblatt

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-648-41-003000

126-91-648-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3396 20.86
- +

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Немедленный

126-91-648-41-003000

Datenblatt

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
28-0501-21

28-0501-21

CONN SOCKET SIP 28POS GOLD

Aries Electronics

3321 20.87
- +

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Немедленный

28-0501-21

Datenblatt

Bulk 501 Active SIP 28 (1 x 28) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
28-0501-31

28-0501-31

CONN SOCKET SIP 28POS GOLD

Aries Electronics

2416 20.87
- +

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Немедленный

28-0501-31

Datenblatt

Bulk 501 Active SIP 28 (1 x 28) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
37-0501-20

37-0501-20

CONN SOCKET SIP 37POS TIN

Aries Electronics

2119 20.87
- +

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Немедленный

37-0501-20

Datenblatt

Bulk 501 Active SIP 37 (1 x 37) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
37-0501-30

37-0501-30

CONN SOCKET SIP 37POS TIN

Aries Electronics

3346 20.87
- +

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Немедленный

37-0501-30

Datenblatt

Bulk 501 Active SIP 37 (1 x 37) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-3508-21

16-3508-21

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2374 20.87
- +

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Немедленный

16-3508-21

Datenblatt

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-3508-31

16-3508-31

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3830 20.87
- +

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Немедленный

16-3508-31

Datenblatt

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
612-43-650-41-004000

612-43-650-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2027 20.89
- +

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Немедленный

612-43-650-41-004000

Datenblatt

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-650-41-004000

612-93-650-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2647 20.89
- +

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Немедленный

612-93-650-41-004000

Datenblatt

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
25-0508-21

25-0508-21

CONN SOCKET SIP 25POS GOLD

Aries Electronics

3155 20.89
- +

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Немедленный

25-0508-21

Datenblatt

Bulk 508 Active SIP 25 (1 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
25-0508-31

25-0508-31

CONN SOCKET SIP 25POS GOLD

Aries Electronics

3832 20.89
- +

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Немедленный

25-0508-31

Datenblatt

Bulk 508 Active SIP 25 (1 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
40-6820-90C

40-6820-90C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3695 20.89
- +

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Немедленный

40-6820-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-6822-90C

40-6822-90C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2979 20.89
- +

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Немедленный

40-6822-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-6823-90C

40-6823-90C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3812 20.89
- +

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Немедленный

40-6823-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
115-44-424-61-003000

115-44-424-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2124 20.89
- +

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Немедленный

Tube * Active - - - - - - - - - - - - - -
612-11-950-41-001000

612-11-950-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3182 20.90
- +

Добавить

Немедленный

612-11-950-41-001000

Datenblatt

Tube 612 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
42-6554-10

42-6554-10

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

3540 20.91
- +

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Немедленный

42-6554-10

Datenblatt

Tray 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-3551-10

42-3551-10

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

2152 20.91
- +

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Немедленный

42-3551-10

Datenblatt

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-3552-10

42-3552-10

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

2140 20.91
- +

Добавить

Немедленный

42-3552-10

Datenblatt

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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