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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
28-8459-610C

28-8459-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2685 19.60
- +

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Немедленный

28-8459-610C

Datenblatt

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-8472-610C

28-8472-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2240 19.60
- +

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Немедленный

28-8472-610C

Datenblatt

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-8495-610C

28-8495-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3146 19.60
- +

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Немедленный

28-8495-610C

Datenblatt

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-8500-610C

28-8500-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3010 19.60
- +

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Немедленный

28-8500-610C

Datenblatt

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-8600-610C

28-8600-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3611 19.60
- +

Добавить

Немедленный

28-8600-610C

Datenblatt

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-8620-610C

28-8620-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3025 19.60
- +

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Немедленный

28-8620-610C

Datenblatt

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-8670-610C

28-8670-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2293 19.60
- +

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Немедленный

28-8670-610C

Datenblatt

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-8675-610C

28-8675-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2388 19.60
- +

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Немедленный

28-8675-610C

Datenblatt

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-8680-610C

28-8680-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3062 19.60
- +

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Немедленный

28-8680-610C

Datenblatt

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-8700-610C

28-8700-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2144 19.60
- +

Добавить

Немедленный

28-8700-610C

Datenblatt

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-8725-610C

28-8725-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3537 19.60
- +

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Немедленный

28-8725-610C

Datenblatt

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-8750-610C

28-8750-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3250 19.60
- +

Добавить

Немедленный

28-8750-610C

Datenblatt

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-8800-610C

28-8800-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3640 19.60
- +

Добавить

Немедленный

28-8800-610C

Datenblatt

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-8830-610C

28-8830-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2450 19.60
- +

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Немедленный

28-8830-610C

Datenblatt

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-43-310-61-003000

116-43-310-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3332 19.60
- +

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Немедленный

Tube * Active - - - - - - - - - - - - - -
116-93-310-61-003000

116-93-310-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3309 19.60
- +

Добавить

Немедленный

Tube * Active - - - - - - - - - - - - - -
110-13-210-61-001000

110-13-210-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2548 19.61
- +

Добавить

Немедленный

Tube * Active - - - - - - - - - - - - - -
612-41-650-41-004000

612-41-650-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2812 19.61
- +

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Немедленный

612-41-650-41-004000

Datenblatt

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-650-41-004000

612-91-650-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2415 19.61
- +

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Немедленный

612-91-650-41-004000

Datenblatt

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
40-6508-301

40-6508-301

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3641 19.62
- +

Добавить

Немедленный

40-6508-301

Datenblatt

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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