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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
38-3513-11H

38-3513-11H

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

2286 19.20
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38-3513-11H

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
117-41-664-41-105000

117-41-664-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2308 19.20
- +

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117-41-664-41-105000

Datenblatt

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-41-764-41-105000

117-41-764-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2681 19.20
- +

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117-41-764-41-105000

Datenblatt

Tube 117 Active DIP, 0.75 (19.05mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
315-13-164-41-001000

315-13-164-41-001000

SOCKET LOW PROFILE SIP 64POS

Mill-Max Manufacturing Corp.

2481 19.21
- +

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Tube 315 Active SIP 64 (1 x 64) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-11-952-41-780000

104-11-952-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2364 19.21
- +

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104-11-952-41-780000

Datenblatt

Tube 104 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
326-93-132-41-003000

326-93-132-41-003000

SOCKET WRAP SOLDERTAIL SIP 32POS

Mill-Max Manufacturing Corp.

2377 19.21
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326-93-132-41-003000

Datenblatt

Tube 326 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-100-10-000001

510-93-100-10-000001

SOCKET SOLDERTAIL 100-PGA

Mill-Max Manufacturing Corp.

2791 19.21
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510-93-100-10-000001

Datenblatt

Tube 510 Active PGA 100 (10 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-100-13-062001

510-93-100-13-062001

SOCKET SOLDERTAIL 100-PGA

Mill-Max Manufacturing Corp.

2824 19.21
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Tube 510 Active PGA 100 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-93-640-41-002000

124-93-640-41-002000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

3747 19.21
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124-93-640-41-002000

Datenblatt

Tube 124 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-43-640-41-002000

124-43-640-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2261 19.21
- +

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Немедленный

124-43-640-41-002000

Datenblatt

Tube 124 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-648-41-001000

612-93-648-41-001000

SOCKET CARRIER SLDRTL .600 48POS

Mill-Max Manufacturing Corp.

2068 19.21
- +

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Немедленный

612-93-648-41-001000

Datenblatt

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-648-41-001000

612-43-648-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3554 19.21
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612-43-648-41-001000

Datenblatt

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
31-7400-10

31-7400-10

CONN SOCKET SIP 31POS TIN

Aries Electronics

3569 19.22
- +

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31-7400-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 31 (1 x 31) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
31-7440-10

31-7440-10

CONN SOCKET SIP 31POS TIN

Aries Electronics

3181 19.22
- +

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Немедленный

31-7440-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 31 (1 x 31) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
31-7500-10

31-7500-10

CONN SOCKET SIP 31POS TIN

Aries Electronics

3197 19.22
- +

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Немедленный

31-7500-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 31 (1 x 31) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-3508-212

16-3508-212

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2443 19.22
- +

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16-3508-212

Datenblatt

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-3508-312

16-3508-312

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2624 19.22
- +

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Немедленный

16-3508-312

Datenblatt

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
115-43-210-61-001000

115-43-210-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3790 19.22
- +

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Tube * Active - - - - - - - - - - - - - -
115-93-210-61-001000

115-93-210-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3078 19.22
- +

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Немедленный

Tube * Active - - - - - - - - - - - - - -
36-3570-10

36-3570-10

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

2020 19.23
- +

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Немедленный

36-3570-10

Datenblatt

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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