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| Фотографии | Производитель. Часть # | Акции | Цены | А | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
42-6556-30CONN IC DIP SOCKET 42POS GOLD |
3525 | 18.85 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 6556 | Active | DIP, 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
42-6556-20CONN IC DIP SOCKET 42POS GOLD |
3030 | 18.85 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 6556 | Active | DIP, 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
28-6621-30CONN IC DIP SOCKET 28POS TIN |
2577 | 18.85 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 6621 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole, Bottom Entry; Through Board | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
132-PGM14015-10CONN SOCKET PGA GOLD |
3793 | 18.86 |
ДобавитьНемедленный |
Datenblatt |
Bulk | PGM | Active | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
132-PGM14016-10CONN SOCKET PGA GOLD |
3233 | 18.86 |
ДобавитьНемедленный |
Datenblatt |
Bulk | PGM | Active | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
612-11-642-41-001000SKT CARRIER SOLDRTL |
2788 | 18.86 |
ДобавитьНемедленный |
Datenblatt |
Tube | 612 | Active | DIP, 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
116-41-950-41-008000CONN IC SKT DBL |
2240 | 18.87 |
ДобавитьНемедленный |
Datenblatt |
Tube | 116 | Active | DIP, 0.9 (22.86mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
116-91-950-41-008000CONN IC SKT DBL |
2836 | 18.87 |
ДобавитьНемедленный |
Datenblatt |
Tube | 116 | Active | DIP, 0.9 (22.86mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
29-0501-21CONN SOCKET SIP 29POS GOLD |
3459 | 18.87 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 501 | Active | SIP | 29 (1 x 29) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
29-0501-31CONN SOCKET SIP 29POS GOLD |
2787 | 18.87 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 501 | Active | SIP | 29 (1 x 29) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
38-0501-20CONN SOCKET SIP 38POS TIN |
3557 | 18.87 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 501 | Active | SIP | 38 (1 x 38) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
38-0501-30CONN SOCKET SIP 38POS TIN |
3424 | 18.87 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 501 | Active | SIP | 38 (1 x 38) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
123-43-632-41-801000CONN IC SKT DBL |
2450 | 18.89 |
ДобавитьНемедленный |
Datenblatt |
Tube | 123 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
123-93-632-41-801000CONN IC SKT DBL |
3977 | 18.89 |
ДобавитьНемедленный |
Datenblatt |
Tube | 123 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
115-43-310-61-001000CONN IC SKT DBL |
2537 | 18.89 |
ДобавитьНемедленный |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
115-93-310-61-001000CONN IC SKT DBL |
2753 | 18.89 |
ДобавитьНемедленный |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
23-0503-21CONN SOCKET SIP 23POS GOLD |
2153 | 18.90 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 0503 | Active | SIP | 23 (1 x 23) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA), Nylon, Glass Filled |
|
|
23-0503-31CONN SOCKET SIP 23POS GOLD |
2508 | 18.90 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 0503 | Active | SIP | 23 (1 x 23) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA), Nylon, Glass Filled |
|
|
133-PGM13046-10CONN SOCKET PGA GOLD |
2080 | 18.90 |
ДобавитьНемедленный |
Datenblatt |
Bulk | PGM | Active | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
133-PGM14013-10CONN SOCKET PGA GOLD |
2875 | 18.90 |
ДобавитьНемедленный |
Datenblatt |
Bulk | PGM | Active | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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