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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
299-93-318-11-001000

299-93-318-11-001000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

3244 19.82
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299-93-318-11-001000

Datenblatt

Tube 299 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-614-10-002000

299-93-614-10-002000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

2054 20.78
- +

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299-93-614-10-002000

Datenblatt

Tube 299 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-616-10-002000

299-93-616-10-002000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

3175 20.83
- +

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Немедленный

299-93-616-10-002000

Datenblatt

Tube 299 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-43-628-41-801000

123-43-628-41-801000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

3921 21.54
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123-43-628-41-801000

Datenblatt

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-43-324-10-001000

299-43-324-10-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

3082 22.03
- +

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299-43-324-10-001000

Datenblatt

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-324-10-001000

299-93-324-10-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

3393 22.03
- +

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Немедленный

299-93-324-10-001000

Datenblatt

Tube 299 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
2201838-2

2201838-2

CONN SOCKET LGA 2011POS GOLD

TE Connectivity AMP Connectors

2640 24.19
- +

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2201838-2

Datenblatt

Bulk - Last Time Buy LGA 2011 (47 x 58) 0.040 (1.02mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.035 (0.90mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic
123-93-640-41-801000

123-93-640-41-801000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

3046 27.41
- +

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Немедленный

123-93-640-41-801000

Datenblatt

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-43-964-41-001000

123-43-964-41-001000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

2713 29.38
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Немедленный

123-43-964-41-001000

Datenblatt

Tube 123 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
200-6311-9UN-1900

200-6311-9UN-1900

CONN SOCKET PGA ZIF 121POS GOLD

3M

2863 53.86
- +

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Немедленный

200-6311-9UN-1900

Datenblatt

Bulk Textool™ Obsolete PGA, ZIF (ZIP) 121 (11 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES)
210-83-308-41-101000

210-83-308-41-101000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

2023 69.83
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Немедленный

Tube 210 Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 300.0µin (7.62µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-83-308-41-530000

110-83-308-41-530000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

3482 69.83
- +

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Немедленный

110-83-308-41-530000

Datenblatt

Tube 110 Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 300.0µin (7.62µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-83-314-41-530000

110-83-314-41-530000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

3950 70.55
- +

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Немедленный

Tube 110 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 300.0µin (7.62µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-83-316-41-530000

110-83-316-41-530000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

3300 70.80
- +

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Немедленный

Tube 110 Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 300.0µin (7.62µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-83-318-41-530000

110-83-318-41-530000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2178 71.11
- +

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Немедленный

110-83-318-41-530000

Datenblatt

Tube 110 Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-83-628-41-530000

110-83-628-41-530000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

2861 72.04
- +

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Немедленный

Tube 110 Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 300.0µin (7.62µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
200-6317-9UN-1900

200-6317-9UN-1900

CONN SOCKET PGA ZIF 289POS GOLD

3M

3844 73.36
- +

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Немедленный

200-6317-9UN-1900

Datenblatt

Bulk Textool™ Obsolete PGA, ZIF (ZIP) 289 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES)
235-3019-01-0602

235-3019-01-0602

CONN ZIG-ZAG ZIF 35POS GOLD

3M

2262 93.01
- +

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Немедленный

235-3019-01-0602

Datenblatt

Bulk Textool™ Active Zig-Zag, ZIF (ZIP) 35 (1 x 17, 1 x 18) 0.050 (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
XR2A-0815

XR2A-0815

CONNECTORS - CONNECTOR

Omron Electronics Inc-EMC Div

107 0.89
- +

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Немедленный

XR2A-0815

Datenblatt

Box * Active - - - - - - - - - - - - - -
110-44-424-41-001000

110-44-424-41-001000

CONN IC DIP SOCKET 24POS TIN

Mill-Max Manufacturing Corp.

5481 1.42
- +

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Немедленный

110-44-424-41-001000

Datenblatt

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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