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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-93-642-41-006000

116-93-642-41-006000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.

2478 15.44
- +

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Немедленный

116-93-642-41-006000

Datenblatt

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-642-41-006000

116-43-642-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2197 15.44
- +

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Немедленный

116-43-642-41-006000

Datenblatt

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-41-642-41-005000

117-41-642-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3550 15.44
- +

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Немедленный

117-41-642-41-005000

Datenblatt

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-422-41-003000

612-41-422-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3161 15.49
- +

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Немедленный

612-41-422-41-003000

Datenblatt

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-322-41-003000

612-91-322-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3153 15.49
- +

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Немедленный

612-91-322-41-003000

Datenblatt

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-422-41-003000

612-91-422-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2284 15.49
- +

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Немедленный

612-91-422-41-003000

Datenblatt

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-328-41-007000

116-41-328-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3959 15.49
- +

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Немедленный

116-41-328-41-007000

Datenblatt

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-320-41-004000

612-41-320-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2944 15.52
- +

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Немедленный

612-41-320-41-004000

Datenblatt

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-420-41-004000

612-41-420-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2841 15.52
- +

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Немедленный

612-41-420-41-004000

Datenblatt

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-320-41-004000

612-91-320-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3375 15.52
- +

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Немедленный

612-91-320-41-004000

Datenblatt

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-420-41-004000

612-91-420-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2351 15.52
- +

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Немедленный

612-91-420-41-004000

Datenblatt

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-420-41-001000

126-93-420-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

3629 15.54
- +

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Немедленный

126-93-420-41-001000

Datenblatt

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-320-41-001000

126-43-320-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3092 15.54
- +

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Немедленный

126-43-320-41-001000

Datenblatt

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-420-41-001000

126-43-420-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2572 15.54
- +

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Немедленный

126-43-420-41-001000

Datenblatt

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-47-648-41-105000

110-47-648-41-105000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

3586 15.54
- +

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Немедленный

110-47-648-41-105000

Datenblatt

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-41-640-41-012000

146-41-640-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.

2212 15.31
- +

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Немедленный

146-41-640-41-012000

Datenblatt

Tube 146 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-91-640-41-012000

146-91-640-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.

2301 15.31
- +

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Немедленный

146-91-640-41-012000

Datenblatt

Tube 146 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-13-318-41-780000

104-13-318-41-780000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

2870 15.31
- +

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Немедленный

104-13-318-41-780000

Datenblatt

Tube 104 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
30-820-90C

30-820-90C

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

3448 15.31
- +

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Немедленный

30-820-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
30-822-90C

30-822-90C

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

2629 15.31
- +

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Немедленный

30-822-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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