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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-13-316-41-801000

110-13-316-41-801000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

2838 6.07
- +

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Немедленный

110-13-316-41-801000

Datenblatt

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-93-324-41-001000

123-93-324-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

2138 6.09
- +

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Немедленный

123-93-324-41-001000

Datenblatt

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-93-624-41-001000

123-93-624-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

2130 6.09
- +

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Немедленный

123-93-624-41-001000

Datenblatt

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-324-41-801000

110-93-324-41-801000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

2986 6.30
- +

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Немедленный

110-93-324-41-801000

Datenblatt

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-87-628-41-117101

114-87-628-41-117101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3886 2.10
- +

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Немедленный

114-87-628-41-117101

Datenblatt

Tube 114 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-43-608-10-002000

299-43-608-10-002000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

2192 6.64
- +

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Немедленный

299-43-608-10-002000

Datenblatt

Tube 299 Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-624-41-801000

110-93-624-41-801000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

3093 6.71
- +

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Немедленный

110-93-624-41-801000

Datenblatt

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-93-328-41-001000

123-93-328-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

2122 6.77
- +

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Немедленный

123-93-328-41-001000

Datenblatt

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-93-628-41-001000

123-93-628-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

3890 6.77
- +

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Немедленный

123-93-628-41-001000

Datenblatt

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-43-328-41-001000

123-43-328-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

2961 6.77
- +

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Немедленный

123-43-328-41-001000

Datenblatt

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-632-31-012000

614-93-632-31-012000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

2066 6.94
- +

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Немедленный

614-93-632-31-012000

Datenblatt

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-316-10-001000

299-93-316-10-001000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

3155 6.97
- +

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Немедленный

299-93-316-10-001000

Datenblatt

Tube 299 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-43-610-10-002000

299-43-610-10-002000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

2792 7.04
- +

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Немедленный

299-43-610-10-002000

Datenblatt

Tube 299 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-628-41-801000

110-93-628-41-801000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

100 7.11
- +

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Немедленный

110-93-628-41-801000

Datenblatt

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-628-41-801000

110-43-628-41-801000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

3048 7.11
- +

Добавить

Немедленный

110-43-628-41-801000

Datenblatt

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APO-308-G-H

APO-308-G-H

CONN DIP ADAPT 8POS

Samtec Inc.

3631 7.34
- +

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Немедленный

Bulk APO Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
4732

4732

COVER PWR TRANS .210ID TO-3

Keystone Electronics

2735 7.97
- +

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Немедленный

4732

Datenblatt

Bulk - Active - - - - - - - - - - - - - -
XR2P2041

XR2P2041

CONN SOCKET SIP 20POS GOLD

Omron Electronics Inc-EMC Div

100 8.12
- +

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Немедленный

XR2P2041

Datenblatt

Bulk XR2 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Threaded - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polybutylene Terephthalate (PBT), Glass Filled
08-823-90

08-823-90

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3656 8.19
- +

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Немедленный

08-823-90

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
299-93-320-10-001000

299-93-320-10-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

3420 8.31
- +

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Немедленный

299-93-320-10-001000

Datenblatt

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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