Sockets for ICs, Transistors - Element(Гонконг) Technology Co., Ltd.

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Производитель. Часть #	Акции	Цены	А	Таблицы данных	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
110-93-628-41-001000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	2217	2.66	- + Добавить Немедленный	Datenblatt	Tube	110	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
4824-6004-CP CONN IC DIP SOCKET 24POS TIN 3M	240	0.89	- + Добавить Немедленный	Datenblatt	Tube	4800	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled
110-99-314-41-001000 CONN IC DIP SOCKET 14POS TINLEAD Mill-Max Manufacturing Corp.	295	0.90	- + Добавить Немедленный	Datenblatt	Tube	110	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
4828-3004-CP CONN IC DIP SOCKET 28POS TIN 3M	481	0.95	- + Добавить Немедленный	Datenblatt	Tube	4800	Active	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled
110-47-314-41-001000 CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp.	224	0.97	- + Добавить Немедленный	Datenblatt	Tube	110	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-93-308-41-001000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	560	0.98	- + Добавить Немедленный	Datenblatt	Tube	210	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
ICM-318-1-GT-HT MACHINE PIN SOCKET, IC, DIP, 18P Adam Tech	430	1.02	- + Добавить Немедленный	Datenblatt	Tube	ICM	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Beryllium Copper	Polyphenylene Sulfide (PPS)
SA203040 CONN IC DIP SOCKET 20POS GOLD On Shore Technology Inc.	1316	1.07	- + Добавить Немедленный	Datenblatt	Tube	SA	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	80.0µin (2.03µm)	Brass	Thermoplastic, Polyester, Glass Filled
DILB32P-223TLF CONN IC DIP SOCKET 32POS TINLEAD Amphenol ICC (FCI)	2983	1.09	- + Добавить Немедленный	Datenblatt	Tube	DILB	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Copper Alloy	Polyamide (PA), Nylon
SA246000 CONN IC DIP SOCKET 24POS GOLD On Shore Technology Inc.	611	1.13	- + Добавить Немедленный	Datenblatt	Tube	SA	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled
SA243000 CONN IC DIP SOCKET 24POS GOLD On Shore Technology Inc.	237	1.13	- + Добавить Немедленный	Datenblatt	Tube	SA	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled
ICM-320-1-GT-HT MACHINE PIN SOCKET, IC, DIP, 20P Adam Tech	140	1.14	- + Добавить Немедленный	Datenblatt	Tube	ICM	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Beryllium Copper	Polyphenylene Sulfide (PPS)
A-CCS 028-Z-SM CONN SOCKET PLCC 28POS TIN Assmann WSW Components	418	1.17	- + Добавить Немедленный	Datenblatt	Tube	-	Active	PLCC	28 (4 x 7)	0.050 (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Polyamide (PA9T), Nylon 9T, Glass Filled
ICM-624-1-GT-HT MACHINE PIN SOCKET, IC, DIP, 24P Adam Tech	401	1.17	- + Добавить Немедленный	Datenblatt	Tube	ICM	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Beryllium Copper	Polyphenylene Sulfide (PPS)
A-CCS 020-Z-T IC SOCKET PLCC 20POS TIN Assmann WSW Components	140	1.20	- + Добавить Немедленный	Datenblatt	Tube	-	Active	PLCC	20 (4 x 5)	0.050 (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT)
PLCC-20-AT PLCC 20P THROUGH HOLE Adam Tech	637	1.23	- + Добавить Немедленный	Datenblatt	Tube	PLCC	Active	PLCC	20 (4 x 5)	0.050 (1.27mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
917-47-103-41-005000 CONN SOCKET TRANSIST TO-5 3POS Mill-Max Manufacturing Corp.	633	1.27	- + Добавить Немедленный	Datenblatt	Tube	917	Active	Transistor, TO-5	3 (Round)	-	Gold	Flash	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
SA243040 CONN IC DIP SOCKET 24POS GOLD On Shore Technology Inc.	520	1.28	- + Добавить Немедленный	Datenblatt	Tube	SA	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	80.0µin (2.03µm)	Brass	Thermoplastic, Polyester, Glass Filled
SA246040 CONN IC DIP SOCKET 24POS GOLD On Shore Technology Inc.	272	1.28	- + Добавить Немедленный	Datenblatt	Tube	SA	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	80.0µin (2.03µm)	Brass	Thermoplastic, Polyester, Glass Filled
210-1-16-003 CONN IC DIP SOCKET 16POS GOLD CNC Tech	905	1.29	- + Добавить Немедленный	Datenblatt	Tube	-	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polybutylene Terephthalate (PBT)