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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
550-80-068-11-061101

550-80-068-11-061101

PGA SOLDER TAIL

Preci-Dip

2646 7.10
- +

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Немедленный

550-80-068-11-061101

Datenblatt

Bulk 550 Active PGA 68 (11 x 11) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-80-068-11-071101

550-80-068-11-071101

PGA SOLDER TAIL

Preci-Dip

3068 7.10
- +

Добавить

Немедленный

550-80-068-11-071101

Datenblatt

Bulk 550 Active PGA 68 (11 x 11) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-144-15-001101

510-83-144-15-001101

CONN SOCKET PGA 144POS GOLD

Preci-Dip

3402 7.11
- +

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Немедленный

510-83-144-15-001101

Datenblatt

Bulk 510 Active PGA 144 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-144-15-081101

510-83-144-15-081101

CONN SOCKET PGA 144POS GOLD

Preci-Dip

3808 7.11
- +

Добавить

Немедленный

510-83-144-15-081101

Datenblatt

Bulk 510 Active PGA 144 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
28-3518-102

28-3518-102

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2835 7.53
- +

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Немедленный

28-3518-102

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-6518-102

28-6518-102

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2748 7.53
- +

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Немедленный

28-6518-102

Datenblatt

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-6513-11

28-6513-11

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3237 7.53
- +

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Немедленный

28-6513-11

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
550-80-068-10-061101

550-80-068-10-061101

PGA SOLDER TAIL

Preci-Dip

3940 7.10
- +

Добавить

Немедленный

550-80-068-10-061101

Datenblatt

Bulk 550 Active PGA 68 (10 x 10) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
15-0511-10

15-0511-10

CONN SOCKET SIP 15POS TIN

Aries Electronics

3989 7.55
- +

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Немедленный

15-0511-10

Datenblatt

Bulk 511 Active SIP 15 (1 x 15) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-820-90T

18-820-90T

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

2125 7.55
- +

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Немедленный

18-820-90T

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
18-820-90TWR

18-820-90TWR

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

2659 7.55
- +

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Немедленный

18-820-90TWR

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
126-93-304-41-001000

126-93-304-41-001000

CONN IC DIP SOCKET 4POS GOLD

Mill-Max Manufacturing Corp.

2921 7.56
- +

Добавить

Немедленный

126-93-304-41-001000

Datenblatt

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-304-41-001000

126-43-304-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2627 7.56
- +

Добавить

Немедленный

126-43-304-41-001000

Datenblatt

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-83-145-15-001101

510-83-145-15-001101

CONN SOCKET PGA 145POS GOLD

Preci-Dip

2371 7.16
- +

Добавить

Немедленный

510-83-145-15-001101

Datenblatt

Bulk 510 Active PGA 145 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-145-15-002101

510-83-145-15-002101

CONN SOCKET PGA 145POS GOLD

Preci-Dip

3974 7.16
- +

Добавить

Немедленный

510-83-145-15-002101

Datenblatt

Bulk 510 Active PGA 145 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-145-15-081101

510-83-145-15-081101

CONN SOCKET PGA 145POS GOLD

Preci-Dip

2757 7.16
- +

Добавить

Немедленный

510-83-145-15-081101

Datenblatt

Bulk 510 Active PGA 145 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-145-17-001101

510-83-145-17-001101

CONN SOCKET PGA 145POS GOLD

Preci-Dip

3863 7.16
- +

Добавить

Немедленный

510-83-145-17-001101

Datenblatt

Bulk 510 Active PGA 145 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-13-628-41-001000

123-13-628-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

3043 7.58
- +

Добавить

Немедленный

123-13-628-41-001000

Datenblatt

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-83-650-41-002101

124-83-650-41-002101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

3626 8.05
- +

Добавить

Немедленный

Bulk 124 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
APA-632-T-A1

APA-632-T-A1

ADAPTER PLUG

Samtec Inc.

3003 7.59
- +

Добавить

Немедленный

Bulk APA Active - 32 (2 x 16) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
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