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| Фотографии | Производитель. Часть # | Акции | Цены | А | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
08-7750-10CONN SOCKET SIP 8POS TIN |
3766 | 7.13 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 8 (1 x 8) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
08-7950-10CONN SOCKET SIP 8POS TIN |
2696 | 7.13 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 8 (1 x 8) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
08-7955-10CONN SOCKET SIP 8POS TIN |
2182 | 7.13 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 8 (1 x 8) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
08-7970-10CONN SOCKET SIP 8POS TIN |
2822 | 7.13 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 8 (1 x 8) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
08-7980-10CONN SOCKET SIP 8POS TIN |
3566 | 7.13 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 8 (1 x 8) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
APA-422-T-CADAPTER PLUG |
3364 | 7.13 |
ДобавитьНемедленный |
Bulk | APA | Active | - | 22 (2 x 11) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
116-87-640-41-004101CONN IC DIP SOCKET 40POS GOLD |
2123 | 6.74 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-145-13-041101CONN SOCKET PGA 145POS GOLD |
2522 | 6.72 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 510 | Active | PGA | 145 (13 x 13) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
12-0503-20CONN SOCKET SIP 12POS GOLD |
2240 | 7.15 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 0503 | Active | SIP | 12 (1 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA), Nylon, Glass Filled |
|
|
12-0503-30CONN SOCKET SIP 12POS GOLD |
3635 | 7.15 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 0503 | Active | SIP | 12 (1 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA), Nylon, Glass Filled |
|
|
28-0518-00CONN SOCKET SIP 28POS GOLD |
3455 | 7.15 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 518 | Active | SIP | 28 (1 x 28) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
28-1518-00CONN IC DIP SOCKET 28POS GOLD |
2369 | 7.15 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 518 | Active | DIP, 0.2 (5.08mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
24-0518-11HCONN SOCKET SIP 24POS GOLD |
3482 | 7.15 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 518 | Active | SIP | 24 (1 x 24) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
24-1518-11HCONN IC DIP SOCKET 24POS GOLD |
2304 | 7.15 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 518 | Active | DIP, 0.2 (5.08mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
02-0511-11CONN SOCKET SIP 2POS GOLD |
3073 | 7.18 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 511 | Active | SIP | 2 (1 x 2) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
06-2503-21CONN IC DIP SOCKET 6POS GOLD |
2452 | 7.18 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 503 | Active | DIP, 0.2 (5.08mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
06-2503-31CONN IC DIP SOCKET 6POS GOLD |
3043 | 7.18 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 503 | Active | DIP, 0.2 (5.08mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
12-6503-20CONN IC DIP SOCKET 12POS GOLD |
3859 | 7.18 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 503 | Active | DIP, 0.6 (15.24mm) Row Spacing | 12 (2 x 6) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
12-6503-30CONN IC DIP SOCKET 12POS GOLD |
2167 | 7.18 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 503 | Active | DIP, 0.6 (15.24mm) Row Spacing | 12 (2 x 6) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
32-6518-101CONN IC DIP SOCKET 32POS GOLD |
3258 | 7.18 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 518 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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