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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-87-128-13-042101

510-87-128-13-042101

CONN SOCKET PGA 128POS GOLD

Preci-Dip

3613 3.86
- +

Добавить

Немедленный

510-87-128-13-042101

Datenblatt

Bulk 510 Active PGA 128 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-128-13-043101

510-87-128-13-043101

CONN SOCKET PGA 128POS GOLD

Preci-Dip

2056 3.86
- +

Добавить

Немедленный

510-87-128-13-043101

Datenblatt

Bulk 510 Active PGA 128 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-128-13-071101

510-87-128-13-071101

CONN SOCKET PGA 128POS GOLD

Preci-Dip

3443 3.86
- +

Добавить

Немедленный

510-87-128-13-071101

Datenblatt

Bulk 510 Active PGA 128 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
APA-314-T-M

APA-314-T-M

ADAPTER PLUG

Samtec Inc.

3045 4.11
- +

Добавить

Немедленный

Tube APA Active - 14 (2 x 7) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
116-83-628-41-001101

116-83-628-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2898 3.98
- +

Добавить

Немедленный

116-83-628-41-001101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-076-11-041101

510-83-076-11-041101

CONN SOCKET PGA 76POS GOLD

Preci-Dip

3354 3.87
- +

Добавить

Немедленный

510-83-076-11-041101

Datenblatt

Bulk 510 Active PGA 76 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-964-41-001101

614-87-964-41-001101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip

2076 3.87
- +

Добавить

Немедленный

614-87-964-41-001101

Datenblatt

Bulk 614 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
714-43-114-31-018000

714-43-114-31-018000

CONN SOCKET SIP 14POS GOLD

Mill-Max Manufacturing Corp.

2319 4.11
- +

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Немедленный

714-43-114-31-018000

Datenblatt

Bulk 714 Active SIP 14 (1 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
22-6513-10

22-6513-10

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

3365 4.11
- +

Добавить

Немедленный

22-6513-10

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
34-3513-10T

34-3513-10T

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

3868 4.11
- +

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Немедленный

34-3513-10T

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
13-0513-11H

13-0513-11H

CONN SOCKET SIP 13POS GOLD

Aries Electronics

3245 4.11
- +

Добавить

Немедленный

13-0513-11H

Datenblatt

Bulk 0513 Active SIP 13 (1 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-0518-11

24-0518-11

CONN SOCKET SIP 24POS GOLD

Aries Electronics

2621 4.11
- +

Добавить

Немедленный

24-0518-11

Datenblatt

Bulk 518 Active SIP 24 (1 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-1518-11

24-1518-11

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3372 4.11
- +

Добавить

Немедленный

24-1518-11

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
299-43-306-11-001000

299-43-306-11-001000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

2998 4.11
- +

Добавить

Немедленный

299-43-306-11-001000

Datenblatt

Tube 299 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
24-6513-10

24-6513-10

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2872 4.11
- +

Добавить

Немедленный

24-6513-10

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-432-41-008101

116-83-432-41-008101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3365 3.88
- +

Добавить

Немедленный

116-83-432-41-008101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-636-41-008101

116-87-636-41-008101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

2209 3.88
- +

Добавить

Немедленный

116-87-636-41-008101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-640-41-008101

116-87-640-41-008101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

2950 3.88
- +

Добавить

Немедленный

116-87-640-41-008101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-084-10-001101

510-83-084-10-001101

CONN SOCKET PGA 84POS GOLD

Preci-Dip

2125 3.90
- +

Добавить

Немедленный

510-83-084-10-001101

Datenblatt

Bulk 510 Active PGA 84 (10 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-084-10-031101

510-83-084-10-031101

CONN SOCKET PGA 84POS GOLD

Preci-Dip

3776 3.90
- +

Добавить

Немедленный

510-83-084-10-031101

Datenblatt

Bulk 510 Active PGA 84 (10 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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