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| Фотографии | Производитель. Часть # | Акции | Цены | А | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
299-43-312-10-001000CONN IC DIP SOCKET 12POS GOLD |
435 | 5.32 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 299 | Active | DIP, 0.3 (7.62mm) Row Spacing | 12 (2 x 6) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
117-87-764-41-005101CONN IC DIP SOCKET 64POS GOLD |
934 | 4.17 |
ДобавитьНемедленный |
Datenblatt |
Tube | 117 | Active | DIP, 0.75 (19.05mm) Row Spacing | 64 (2 x 32) | 0.070 (1.78mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070 (1.78mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
110-13-640-41-001000CONN IC DIP SOCKET 40POS GOLD |
194 | 5.69 |
ДобавитьНемедленный |
Datenblatt |
Tube | 110 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
D01-9952042CONN SOCKET SIP 20POS GOLD |
364 | 5.74 |
ДобавитьНемедленный |
Datenblatt |
Bulk | D01-995 | Active | SIP | 20 (1 x 20) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
299-93-314-10-001000CONN IC DIP SOCKET 14POS GOLD |
402 | 6.14 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 299 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
110-13-320-41-801000CONN IC DIP SOCKET 20POS GOLD |
149 | 6.67 |
ДобавитьНемедленный |
Datenblatt |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
110-93-320-41-801000CONN IC DIP SOCKET 20POS GOLD |
1028 | 5.61 |
ДобавитьНемедленный |
Datenblatt |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
28-C182-10CONN IC DIP SOCKET 28POS GOLD |
2064 | 7.42 |
ДобавитьНемедленный |
Datenblatt |
Bulk | EJECT-A-DIP™ | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
299-43-320-10-001000CONN IC DIP SOCKET 20POS GOLD |
124 | 8.31 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 299 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
10-2810-90CCONN IC DIP SOCKET 10POS GOLD |
719 | 8.39 |
ДобавитьНемедленный |
Datenblatt |
Bulk | Vertisockets™ 800 | Active | DIP, 0.2 (5.08mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Vertical | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
10-2820-90CCONN IC DIP SOCKET 10POS GOLD |
142 | 8.43 |
ДобавитьНемедленный |
Datenblatt |
Bulk | Vertisockets™ 800 | Active | DIP, 0.2 (5.08mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
10-2810-90TCONN IC DIP SOCKET 10POS TIN |
460 | 8.80 |
ДобавитьНемедленный |
Datenblatt |
Bulk | Vertisockets™ 800 | Active | DIP, 0.2 (5.08mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole, Right Angle, Vertical | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 |
|
40-C182-10CONN IC DIP SOCKET 40POS GOLD |
252 | 10.34 |
ДобавитьНемедленный |
Datenblatt |
Bulk | EJECT-A-DIP™ | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
28-526-10CONN IC DIP SOCKET ZIF 28POS TIN |
1360 | 12.64 |
ДобавитьНемедленный |
Datenblatt |
Bulk | Lo-PRO®file, 526 | Active | DIP, ZIF (ZIP) | 28 (2 x 14) | 0.100 (2.54mm) | Tin | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 10.0µin (0.25µm) | Beryllium Copper | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
12-810-90CCONN IC DIP SOCKET 12POS GOLD |
322 | 13.02 |
ДобавитьНемедленный |
Datenblatt |
Bulk | Vertisockets™ 800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 12 (2 x 6) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Vertical | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
TDU03DTODCONN SOCKET TRANSIST 3POS GOLD |
110 | 13.80 |
ДобавитьНемедленный |
Datenblatt |
Tray | - | Active | Transistor | 3 (Rectangular) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Board Guide, Flange | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
714-43-164-31-018000CONN SOCKET SIP 64POS GOLD |
259 | 13.93 |
ДобавитьНемедленный |
Datenblatt |
Tube | 714 | Active | SIP | 64 (1 x 64) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
25-0503-30CONN SOCKET SIP 25POS GOLD |
120 | 14.39 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 0503 | Active | SIP | 25 (1 x 25) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA), Nylon, Glass Filled |
|
40-526-10CONN IC DIP SOCKET ZIF 40POS TIN |
3267 | 15.18 |
ДобавитьНемедленный |
Datenblatt |
Bulk | Lo-PRO®file, 526 | Active | DIP, ZIF (ZIP) | 40 (2 x 20) | 0.100 (2.54mm) | Tin | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 10.0µin (0.25µm) | Beryllium Copper | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
32-6554-10CONN IC DIP SOCKET ZIF 32POS TIN |
706 | 16.20 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
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