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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-83-624-41-002101

116-83-624-41-002101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2189 2.84
- +

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Немедленный

116-83-624-41-002101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-640-41-003101

116-87-640-41-003101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

3756 2.84
- +

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Немедленный

116-87-640-41-003101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-318-11-001101

299-87-318-11-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

2211 2.84
- +

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Немедленный

299-87-318-11-001101

Datenblatt

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-964-41-001101

110-87-964-41-001101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip

3786 2.84
- +

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Немедленный

110-87-964-41-001101

Datenblatt

Bulk 110 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
4734

4734

COVER PWR TRANS .210ID TO-3

Keystone Electronics

2297 3.01
- +

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Немедленный

4734

Datenblatt

Bulk - Active - - - - - - - - - - - - - -
APA-308-G-J

APA-308-G-J

ADAPTER PLUG

Samtec Inc.

2129 3.02
- +

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Немедленный

Tube APA Active - 8 (2 x 4) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
13-0513-10H

13-0513-10H

CONN SOCKET SIP 13POS GOLD

Aries Electronics

3753 3.02
- +

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Немедленный

13-0513-10H

Datenblatt

Bulk 0513 Active SIP 13 (1 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-0513-10

18-0513-10

CONN SOCKET SIP 18POS GOLD

Aries Electronics

2380 3.02
- +

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Немедленный

18-0513-10

Datenblatt

Bulk 0513 Active SIP 18 (1 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
ICO-308-LGT

ICO-308-LGT

CONN IC DIP SOCKET 8POS GOLD

Samtec Inc.

2639 3.03
- +

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Немедленный

ICO-308-LGT

Datenblatt

Tube ICO Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
14-0518-00

14-0518-00

CONN SOCKET SIP 14POS GOLD

Aries Electronics

2054 3.31
- +

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Немедленный

14-0518-00

Datenblatt

Bulk 518 Active SIP 14 (1 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-1518-00

14-1518-00

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2354 3.31
- +

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Немедленный

14-1518-00

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
19-0518-11

19-0518-11

CONN SOCKET SIP 19POS GOLD

Aries Electronics

3606 3.31
- +

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Немедленный

19-0518-11

Datenblatt

Bulk 518 Active SIP 19 (1 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-0518-10

28-0518-10

CONN SOCKET SIP 28POS GOLD

Aries Electronics

2971 3.31
- +

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Немедленный

28-0518-10

Datenblatt

Bulk 518 Active SIP 28 (1 x 28) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
XR2A-1625

XR2A-1625

CONN IC DIP SOCKET 16POS GOLD

Omron Electronics Inc-EMC Div

2034 1.62
- +

Добавить

Немедленный

XR2A-1625

Datenblatt

Bulk,Box XR2 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
24-0518-10H

24-0518-10H

CONN SOCKET SIP 24POS GOLD

Aries Electronics

3259 3.36
- +

Добавить

Немедленный

24-0518-10H

Datenblatt

Bulk 518 Active SIP 24 (1 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-1518-10H

24-1518-10H

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2191 3.36
- +

Добавить

Немедленный

24-1518-10H

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
117-83-652-41-005101

117-83-652-41-005101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

3180 3.46
- +

Добавить

Немедленный

117-83-652-41-005101

Datenblatt

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-650-41-006101

116-87-650-41-006101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

3327 3.25
- +

Добавить

Немедленный

116-87-650-41-006101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-068-10-001101

510-83-068-10-001101

CONN SOCKET PGA 68POS GOLD

Preci-Dip

3096 3.15
- +

Добавить

Немедленный

510-83-068-10-001101

Datenblatt

Bulk 510 Active PGA 68 (10 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
18-3511-10

18-3511-10

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

3498 3.39
- +

Добавить

Немедленный

18-3511-10

Datenblatt

Bulk 511 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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