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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
803-47-010-20-001000

803-47-010-20-001000

CONN RCPT 10POS 0.1 GOLD PCB R/A

Mill-Max Manufacturing Corp.

 713 17.50
- +

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Немедленный

 803-47-010-20-001000

Datenblatt

 Tube 803 Active Receptacle Female Socket Board to Board 10 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole, Right Angle Solder Push-Pull Gold Flash Black 0.200 (5.08mm) 0.126 (3.20mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-115-33-S-T

ESQ-115-33-S-T

CONN SOCKET 45POS 0.1 GOLD PCB

Samtec Inc.

 2240 17.51
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 ESQ-115-33-S-T

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 45 All 0.100 (2.54mm) 3 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.635 (16.13mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
SSM-122-S-DH

SSM-122-S-DH

CONN RCPT .100 44POS DUAL HORZ

Samtec Inc.

 2895 17.57
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Немедленный

 Tube SSM Active Receptacle Female Socket Board to Board or Cable 44 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount, Right Angle Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.225 (5.72mm) - -55°C ~ 125°C - Tin - -
ESW-130-37-G-D-LL

ESW-130-37-G-D-LL

CONN SOCKET 60POS 0.1 GOLD PCB

Samtec Inc.

 3756 17.60
- +

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 ESW-130-37-G-D-LL

Datenblatt

 Tube ESW Active Elevated Socket Forked Board to Board 60 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Kinked Pin, Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435 (11.05mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Gold - -
SQW-145-01-L-D

SQW-145-01-L-D

CONN RCPT 2MM 90POS DL VERT PCB

Samtec Inc.

 2093 17.62
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Немедленный

 Tube SQW Active Receptacle Forked Board to Board or Cable 90 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.250 (6.35mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
SSW-140-02-S-D

SSW-140-02-S-D

CONN RCPT .100 80POS DUAL GOLD

Samtec Inc.

 3199 17.66
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Немедленный

 Bulk SSW Active Receptacle Forked Board to Board or Cable 80 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.335 (8.51mm) 0.194 (4.93mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-126-37-S-D

ESQ-126-37-S-D

CONN SOCKET 52POS 0.1 GOLD PCB

Samtec Inc.

 3717 17.66
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Немедленный

 ESQ-126-37-S-D

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 52 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.435 (11.05mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
HLE-130-02-G-DV-BE-LC-P

HLE-130-02-G-DV-BE-LC-P

CONN RCPT 60POS 0.1 GOLD SMD

Samtec Inc.

 2988 17.68
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 Tube HLE Active Receptacle, Bottom Entry Female Socket Board to Board 60 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.144 (3.66mm) - -55°C ~ 125°C - Gold - -
ESQ-128-37-G-D

ESQ-128-37-G-D

CONN SOCKET 56POS 0.1 GOLD PCB

Samtec Inc.

 3789 17.82
- +

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Немедленный

 ESQ-128-37-G-D

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 56 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435 (11.05mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Gold - -
HLE-125-02-S-DV-A

HLE-125-02-S-DV-A

CONN RCPT 50POS 0.1 GOLD SMD

Samtec Inc.

 3983 17.84
- +

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Немедленный

 Tube HLE Active Receptacle Female Socket Board to Board 50 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.144 (3.66mm) - -55°C ~ 125°C - Tin - -
ESW-132-12-S-D-LL

ESW-132-12-S-D-LL

CONN SOCKET 64POS 0.1 GOLD PCB

Samtec Inc.

 2545 17.84
- +

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Немедленный

 ESW-132-12-S-D-LL

Datenblatt

 Tube ESW Active Elevated Socket Forked Board to Board 64 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Kinked Pin, Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.435 (11.05mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
FLE-144-01-G-DV-A

FLE-144-01-G-DV-A

CONN RCPT 88POS 0.05 GOLD SMD

Samtec Inc.

 2775 17.86
- +

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Немедленный

 FLE-144-01-G-DV-A

Datenblatt

 Tube FLE Active Receptacle Female Socket Board to Board or Cable 88 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.172 (4.37mm) - -55°C ~ 125°C - Gold - -
SSM-135-L-DH

SSM-135-L-DH

CONN RCPT .100 70POS DUAL HORZ

Samtec Inc.

 2241 17.93
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Немедленный

 Tube SSM Active Receptacle Female Socket Board to Board or Cable 70 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount, Right Angle Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.225 (5.72mm) - -55°C ~ 125°C - Tin - -
ESQ-131-12-G-D

ESQ-131-12-G-D

CONN SOCKET 62POS 0.1 GOLD PCB

Samtec Inc.

 2881 17.93
- +

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Немедленный

 ESQ-131-12-G-D

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 62 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435 (11.05mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQ-116-33-G-T

ESQ-116-33-G-T

CONN SOCKET 48POS 0.1 GOLD PCB

Samtec Inc.

 3682 17.93
- +

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Немедленный

 ESQ-116-33-G-T

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 48 All 0.100 (2.54mm) 3 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.635 (16.13mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQ-114-58-S-T

ESQ-114-58-S-T

CONN SOCKET 42POS 0.1 GOLD PCB

Samtec Inc.

 3767 17.97
- +

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Немедленный

 ESQ-114-58-S-T

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 42 All 0.100 (2.54mm) 3 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.535 (13.60mm) 0.380 (9.65mm) -55°C ~ 125°C UL94 V-0 Tin - -
SQW-146-01-L-D

SQW-146-01-L-D

CONN RCPT 2MM 92POS DL VERT PCB

Samtec Inc.

 3788 17.99
- +

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Немедленный

 Tube SQW Active Receptacle Forked Board to Board or Cable 92 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.250 (6.35mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESW-134-12-G-D

ESW-134-12-G-D

CONN SOCKET 68POS 0.1 GOLD PCB

Samtec Inc.

 3639 18.01
- +

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Немедленный

 ESW-134-12-G-D

Datenblatt

 Tube ESW Active Elevated Socket Forked Board to Board 68 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435 (11.05mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESW-132-12-S-D-19

ESW-132-12-S-D-19

CONN SOCKET 64POS 0.1 GOLD PCB

Samtec Inc.

 2832 18.01
- +

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Немедленный

 ESW-132-12-S-D-19

Datenblatt

 Tube ESW Active Elevated Socket Forked Board to Board 64 63 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.435 (11.05mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESW-132-12-S-D-46

ESW-132-12-S-D-46

CONN SOCKET 64POS 0.1 GOLD PCB

Samtec Inc.

 3244 18.01
- +

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Немедленный

 ESW-132-12-S-D-46

Datenblatt

 Tube ESW Active Elevated Socket Forked Board to Board 64 63 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.435 (11.05mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
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