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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
SSQ-121-02-G-S-RA

SSQ-121-02-G-S-RA

CONN RCPT .100 21POS R/A SGL AU

Samtec Inc.

 2490 7.26
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 SSQ-121-02-G-S-RA

Datenblatt

 Bulk SSQ Active Receptacle Forked Board to Board or Cable 21 All 0.100 (2.54mm) 1 - Through Hole, Right Angle Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.095 (2.41mm) 0.100 (2.54mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQ-109-38-S-D

ESQ-109-38-S-D

CONN SOCKET 18POS 0.1 GOLD PCB

Samtec Inc.

 3756 7.26
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 ESQ-109-38-S-D

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 18 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.435 (11.05mm) 0.290 (7.37mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-109-33-S-D

ESQ-109-33-S-D

CONN SOCKET 18POS 0.1 GOLD PCB

Samtec Inc.

 3308 7.26
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Немедленный

 ESQ-109-33-S-D

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 18 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.635 (16.13mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESW-109-34-G-D-LL

ESW-109-34-G-D-LL

CONN SOCKET 18POS 0.1 GOLD PCB

Samtec Inc.

 3273 7.26
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 ESW-109-34-G-D-LL

Datenblatt

 Tube ESW Active Elevated Socket Forked Board to Board 18 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Kinked Pin, Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.635 (16.13mm) 0.280 (7.11mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQ-112-23-L-D

ESQ-112-23-L-D

CONN SOCKET 24POS 0.1 GOLD PCB

Samtec Inc.

 2439 7.26
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 ESQ-112-23-L-D

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 24 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.535 (13.60mm) 0.190 (4.83mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-116-23-S-S

ESQ-116-23-S-S

CONN SOCKET 16POS 0.1 GOLD PCB

Samtec Inc.

 2377 7.26
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Немедленный

 ESQ-116-23-S-S

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 16 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.535 (13.60mm) 0.190 (4.83mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-112-69-S-S

ESQ-112-69-S-S

CONN SOCKET 12POS 0.1 GOLD PCB

Samtec Inc.

 2569 7.26
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Немедленный

 ESQ-112-69-S-S

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 12 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.735 (18.67mm) 0.180 (4.57mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESW-113-23-L-D

ESW-113-23-L-D

CONN SOCKET 26POS 0.1 GOLD PCB

Samtec Inc.

 3716 7.26
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Немедленный

 ESW-113-23-L-D

Datenblatt

 Tube ESW Active Elevated Socket Forked Board to Board 26 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.535 (13.60mm) 0.190 (4.83mm) -55°C ~ 125°C UL94 V-0 Tin - -
CLP-124-02-L-D

CLP-124-02-L-D

CONN RCPT 48POS 0.05 GOLD SMD

Samtec Inc.

 1702 10.57
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 CLP-124-02-L-D

Datenblatt

 Bulk CLP Active Receptacle Female Socket Board to Board 48 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.090 (2.29mm) - -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-110-37-G-D

ESQ-110-37-G-D

CONN SOCKET 20POS 0.1 GOLD PCB

Samtec Inc.

 2869 7.28
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Немедленный

 ESQ-110-37-G-D

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 20 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435 (11.05mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQ-111-12-G-D

ESQ-111-12-G-D

CONN SOCKET 22POS 0.1 GOLD PCB

Samtec Inc.

 3199 7.28
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Немедленный

 ESQ-111-12-G-D

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 22 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435 (11.05mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQ-118-12-S-S

ESQ-118-12-S-S

CONN SOCKET 18POS 0.1 GOLD PCB

Samtec Inc.

 3389 7.28
- +

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Немедленный

 ESQ-118-12-S-S

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 18 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.435 (11.05mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-106-13-S-T

ESQ-106-13-S-T

CONN SOCKET 18POS 0.1 GOLD PCB

Samtec Inc.

 3348 7.28
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Немедленный

 ESQ-106-13-S-T

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 18 All 0.100 (2.54mm) 3 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.435 (11.05mm) 0.290 (7.37mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-117-37-G-S

ESQ-117-37-G-S

CONN SOCKET 17POS 0.1 GOLD PCB

Samtec Inc.

 2570 7.28
- +

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Немедленный

 ESQ-117-37-G-S

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 17 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435 (11.05mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQ-116-38-G-S

ESQ-116-38-G-S

CONN SOCKET 16POS 0.1 GOLD PCB

Samtec Inc.

 2809 7.28
- +

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Немедленный

 ESQ-116-38-G-S

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 16 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435 (11.05mm) 0.290 (7.37mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQ-116-33-G-S

ESQ-116-33-G-S

CONN SOCKET 16POS 0.1 GOLD PCB

Samtec Inc.

 2334 7.28
- +

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Немедленный

 ESQ-116-33-G-S

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 16 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.635 (16.13mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESW-110-33-G-D-LL

ESW-110-33-G-D-LL

CONN SOCKET 20POS 0.1 GOLD PCB

Samtec Inc.

 3245 7.28
- +

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Немедленный

 ESW-110-33-G-D-LL

Datenblatt

 Tube ESW Active Elevated Socket Forked Board to Board 20 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Kinked Pin, Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.635 (16.13mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQ-111-23-T-T

ESQ-111-23-T-T

CONN SOCKET 33POS 0.1 TIN PCB

Samtec Inc.

 3222 7.28
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Немедленный

 ESQ-111-23-T-T

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 33 All 0.100 (2.54mm) 3 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.535 (13.60mm) 0.190 (4.83mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESW-111-37-G-D

ESW-111-37-G-D

CONN SOCKET 22POS 0.1 GOLD PCB

Samtec Inc.

 2375 7.31
- +

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Немедленный

 ESW-111-37-G-D

Datenblatt

 Tube ESW Active Elevated Socket Forked Board to Board 22 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435 (11.05mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQ-109-48-G-D

ESQ-109-48-G-D

CONN SOCKET 18POS 0.1 GOLD PCB

Samtec Inc.

 2209 7.31
- +

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Немедленный

 ESQ-109-48-G-D

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 18 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.535 (13.60mm) 0.190 (4.83mm) -55°C ~ 125°C UL94 V-0 Gold - -
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