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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
ESW-116-33-S-S

ESW-116-33-S-S

CONN SOCKET 16POS 0.1 GOLD PCB

Samtec Inc.

 2505 6.96
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Немедленный

 ESW-116-33-S-S

Datenblatt

 Tube ESW Active Elevated Socket Forked Board to Board 16 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.635 (16.13mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-133-12-T-S

ESQ-133-12-T-S

CONN SOCKET 33POS 0.1 TIN PCB

Samtec Inc.

 3048 6.96
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 ESQ-133-12-T-S

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 33 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.435 (11.05mm) 0.090 (2.29mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESW-110-23-G-D-LL

ESW-110-23-G-D-LL

CONN SOCKET 20POS 0.1 GOLD PCB

Samtec Inc.

 3722 6.96
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 ESW-110-23-G-D-LL

Datenblatt

 Tube ESW Active Elevated Socket Forked Board to Board 20 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Kinked Pin, Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.535 (13.60mm) 0.190 (4.83mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQ-110-33-T-T

ESQ-110-33-T-T

CONN SOCKET 30POS 0.1 TIN PCB

Samtec Inc.

 3467 6.96
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Немедленный

 ESQ-110-33-T-T

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 30 All 0.100 (2.54mm) 3 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.635 (16.13mm) 0.090 (2.29mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESQ-111-13-T-T

ESQ-111-13-T-T

CONN SOCKET 33POS 0.1 TIN PCB

Samtec Inc.

 2171 6.96
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Немедленный

 ESQ-111-13-T-T

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 33 All 0.100 (2.54mm) 3 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.435 (11.05mm) 0.290 (7.37mm) -55°C ~ 105°C UL94 V-0 Tin - -
SSW-124-02-G-D

SSW-124-02-G-D

CONN RCPT 48POS 0.1 GOLD PCB

Samtec Inc.

 1972 10.19
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 SSW-124-02-G-D

Datenblatt

 Bulk SSW Active Receptacle Forked Board to Board or Cable 48 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.335 (8.51mm) 0.194 (4.93mm) -55°C ~ 125°C UL94 V-0 Gold - -
SQW-113-01-L-D-VS

SQW-113-01-L-D-VS

CONN RCPT 2MM 26POS DL VERT SMD

Samtec Inc.

 2453 6.98
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 SQW-113-01-L-D-VS

Datenblatt

 Tube SQW Active Receptacle Forked Board to Board or Cable 26 All 0.079 (2.00mm) 2 0.079 (2.00mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.300 (7.62mm) - -55°C ~ 125°C UL94 V-0 Tin - -
FLE-121-01-G-DV

FLE-121-01-G-DV

CONN RCPT 42POS 0.05 GOLD SMD

Samtec Inc.

 136 10.34
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 FLE-121-01-G-DV

Datenblatt

 Bulk FLE Active Receptacle Female Socket Board to Board or Cable 42 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.172 (4.37mm) - -55°C ~ 125°C - Gold - -
ESQ-105-13-S-T

ESQ-105-13-S-T

CONN SOCKET 15POS 0.1 GOLD PCB

Samtec Inc.

 3754 6.98
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Немедленный

 ESQ-105-13-S-T

Datenblatt

 Bulk ESQ Active Elevated Socket Forked Board to Board 15 All 0.100 (2.54mm) 3 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.435 (11.05mm) 0.290 (7.37mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-106-13-G-T

ESQ-106-13-G-T

CONN SOCKET 18POS 0.1 GOLD PCB

Samtec Inc.

 3408 6.98
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Немедленный

 ESQ-106-13-G-T

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 18 All 0.100 (2.54mm) 3 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435 (11.05mm) 0.290 (7.37mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQ-109-33-G-D

ESQ-109-33-G-D

CONN SOCKET 18POS 0.1 GOLD PCB

Samtec Inc.

 3777 6.98
- +

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Немедленный

 ESQ-109-33-G-D

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 18 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.635 (16.13mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Gold - -
SSQ-120-03-G-D

SSQ-120-03-G-D

CONN RCPT 40POS 0.1 GOLD PCB

Samtec Inc.

 209 9.96
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Немедленный

 SSQ-120-03-G-D

Datenblatt

 Bulk SSQ Active Receptacle Forked Board to Board or Cable 40 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.335 (8.51mm) 0.394 (10.00mm) -55°C ~ 125°C UL94 V-0 Gold - -
SSW-121-02-S-D-RA

SSW-121-02-S-D-RA

CONN RCPT 42POS 0.1 GOLD PCB R/A

Samtec Inc.

 181 10.22
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Немедленный

 SSW-121-02-S-D-RA

Datenblatt

 Bulk SSW Active Receptacle Forked Board to Board or Cable 42 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole, Right Angle Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.195 (4.95mm) 0.100 (2.54mm) -55°C ~ 125°C UL94 V-0 Tin - -
HLE-107-02-G-DV-BE-LC-P

HLE-107-02-G-DV-BE-LC-P

CONN RCPT 14POS 0.1 GOLD SMD

Samtec Inc.

 2664 7.01
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Немедленный

 Tube HLE Active Receptacle, Bottom Entry Female Socket Board to Board 14 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.144 (3.66mm) - -55°C ~ 125°C - Gold - -
HLE-110-02-G-DV-LC-P

HLE-110-02-G-DV-LC-P

CONN RCPT 20POS 0.1 GOLD SMD

Samtec Inc.

 3990 7.01
- +

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Немедленный

 Tube HLE Active Receptacle Female Socket Board to Board 20 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.144 (3.66mm) - -55°C ~ 125°C - Gold - -
ESQ-118-12-G-S

ESQ-118-12-G-S

CONN SOCKET 18POS 0.1 GOLD PCB

Samtec Inc.

 3956 7.01
- +

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Немедленный

 ESQ-118-12-G-S

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 18 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435 (11.05mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQ-109-14-G-D

ESQ-109-14-G-D

CONN SOCKET 18POS 0.1 GOLD PCB

Samtec Inc.

 3812 7.01
- +

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Немедленный

 ESQ-109-14-G-D

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 18 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435 (11.05mm) 0.480 (12.19mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQ-110-34-L-D

ESQ-110-34-L-D

CONN SOCKET 20POS 0.1 GOLD PCB

Samtec Inc.

 3192 7.01
- +

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Немедленный

 ESQ-110-34-L-D

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 20 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.635 (16.13mm) 0.280 (7.11mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-111-14-L-D

ESQ-111-14-L-D

CONN SOCKET 22POS 0.1 GOLD PCB

Samtec Inc.

 2523 7.01
- +

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Немедленный

 ESQ-111-14-L-D

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 22 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.435 (11.05mm) 0.480 (12.19mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESW-116-38-S-S

ESW-116-38-S-S

CONN SOCKET 16POS 0.1 GOLD PCB

Samtec Inc.

 3039 7.01
- +

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Немедленный

 ESW-116-38-S-S

Datenblatt

 Tube ESW Active Elevated Socket Forked Board to Board 16 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.435 (11.05mm) 0.290 (7.37mm) -55°C ~ 125°C UL94 V-0 Tin - -
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