Rectangular Connectors - Headers, Receptacles, Female Sockets - Element(Гонконг) Technology Co., Ltd.

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Производитель. Часть #	Акции	Цены	А	Таблицы данных	Packaging	Series	ProductStatus	ConnectorType	ContactType	Style	NumberofPositions	NumberofPositionsLoaded	Pitch-Mating	NumberofRows	RowSpacing-Mating	MountingType	Termination	FasteningType	ContactFinish-Mating	ContactFinishThickness-Mating	InsulationColor	InsulationHeight	ContactLength-Post	OperatingTemperature	MaterialFlammabilityRating	ContactFinish-Post	MatedStackingHeights	IngressProtection
SSQ-125-21-F-D CONN RCPT 50POS 0.1 GOLD PCB Samtec Inc.	2978	9.59	- + Добавить Немедленный	Datenblatt	Bulk	SSQ	Active	Receptacle	Forked	Board to Board or Cable	50	All	0.100 (2.54mm)	2	0.100 (2.54mm)	Through Hole	Solder	Push-Pull	Gold	3.00µin (0.076µm)	Black	0.335 (8.51mm)	0.104 (2.64mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-
ESW-120-12-L-D CONN SOCKET 40POS 0.1 GOLD PCB Samtec Inc.	2800	9.59	- + Добавить Немедленный	Datenblatt	Tube	ESW	Active	Elevated Socket	Forked	Board to Board	40	All	0.100 (2.54mm)	2	0.100 (2.54mm)	Through Hole	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.435 (11.05mm)	0.090 (2.29mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-
CLP-112-02-L-DH-A CONN RCPT 24P 0.05 GOLD SMD R/A Samtec Inc.	2944	9.62	- + Добавить Немедленный	Datenblatt	Tube	CLP	Active	Receptacle	Female Socket	Board to Board	24	All	0.050 (1.27mm)	2	0.050 (1.27mm)	Surface Mount, Right Angle	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.135 (3.43mm)	-	-55°C ~ 125°C	UL94 V-0	Tin	-	-
CLT-108-02-H-D-BE-A-P CONN RCPT 16POS 0.079 GOLD SMD Samtec Inc.	3862	9.64	- + Добавить Немедленный	Datenblatt	Tube	CLT	Active	Receptacle, Bottom Entry	Female Socket	Board to Board	16	All	0.079 (2.00mm)	2	0.079 (2.00mm)	Surface Mount	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.083 (2.10mm)	-	-55°C ~ 125°C	UL94 V-0	Gold	-	-
CLP-116-02-L-D-BE-A CONN RCPT 32POS 0.05 GOLD SMD Samtec Inc.	2341	9.64	- + Добавить Немедленный	Datenblatt	Tube	CLP	Active	Receptacle, Bottom Entry	Female Socket	Board to Board	32	All	0.050 (1.27mm)	2	0.050 (1.27mm)	Surface Mount	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.084 (2.14mm)	-	-55°C ~ 125°C	UL94 V-0	Tin	-	-
CLP-118-02-G-D-A CONN RCPT 36POS 0.05 GOLD SMD Samtec Inc.	3140	9.66	- + Добавить Немедленный	Datenblatt	Tube	CLP	Active	Receptacle	Female Socket	Board to Board	36	All	0.050 (1.27mm)	2	0.050 (1.27mm)	Surface Mount	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.084 (2.14mm)	-	-55°C ~ 125°C	UL94 V-0	Gold	-	-
FLE-120-01-G-DV-A-P CONN RCPT 40POS 0.05 GOLD SMD Samtec Inc.	3754	9.71	- + Добавить Немедленный	Datenblatt	Tube	FLE	Active	Receptacle	Female Socket	Board to Board or Cable	40	All	0.050 (1.27mm)	2	0.050 (1.27mm)	Surface Mount	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.172 (4.37mm)	-	-55°C ~ 125°C	-	Gold	-	-
ESQ-115-12-S-D CONN SOCKET 30POS 0.1 GOLD PCB Samtec Inc.	3082	9.90	- + Добавить Немедленный	Datenblatt	Tube	ESQ	Active	Elevated Socket	Forked	Board to Board	30	All	0.100 (2.54mm)	2	0.100 (2.54mm)	Through Hole	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.435 (11.05mm)	0.090 (2.29mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-
SDL-108-G-19 CONN SKT .100 16POS Samtec Inc.	3229	9.93	- + Добавить Немедленный		Tube	SDL	Active	Receptacle	Female Socket	Board to Board	16	All	0.100 (2.54mm)	2	0.100 (2.54mm)	Through Hole	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.083 (2.10mm)	0.082 (2.08mm)	-55°C ~ 125°C	-	-	-	-
CLE-117-01-G-DV-A-K CONN RCPT 34POS 0.031 GOLD SMD Samtec Inc.	3472	9.97	- + Добавить Немедленный	Datenblatt	Tube	CLE	Active	Receptacle, Pass Through	Female Socket	Board to Board	34	All	0.031 (0.80mm)	2	0.047 (1.20mm)	Surface Mount	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.130 (3.30mm)	-	-55°C ~ 125°C	UL94 V-0	Gold	-	-
CLT-113-02-S-D-BE CONN RCPT 26POS 0.079 GOLD SMD Samtec Inc.	2456	10.19	- + Добавить Немедленный	Datenblatt	Bulk	CLT	Active	Receptacle, Bottom Entry	Female Socket	Board to Board	26	All	0.079 (2.00mm)	2	0.079 (2.00mm)	Surface Mount	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.083 (2.10mm)	-	-55°C ~ 125°C	UL94 V-0	Tin	-	-
SLM-138-01-S-S .050 MICRO STRIPS Samtec Inc.	3077	10.24	- + Добавить Немедленный	Datenblatt	Tube	SLM	Active	Receptacle	Forked	Board to Board	38	All	0.050 (1.27mm)	1	-	Through Hole	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.180 (4.57mm)	0.115 (2.92mm)	-55°C ~ 125°C	-	Tin	-	-
ESQ-116-24-L-D CONN SOCKET 32POS 0.1 GOLD PCB Samtec Inc.	100	10.26	- + Добавить Немедленный	Datenblatt	Bulk	ESQ	Active	Elevated Socket	Forked	Board to Board	32	All	0.100 (2.54mm)	2	0.100 (2.54mm)	Through Hole	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.535 (13.60mm)	0.380 (9.65mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-
MPSC-02-40-02-7.70-03-L-V 5.00 MM POWERSTRIP/30 A SIGNAL/ Samtec Inc.	3121	10.27	- + Добавить Немедленный		Tray	PowerStrip™ 30 MPSC	Active	Receptacle	Forked	Board to Board	44 (40 + 4 Power)	All	-	4	0.079 (2.00mm)	Through Hole	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.298 (7.57mm)	0.139 (3.53mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-
ESQT-115-02-L-D-790 CONN SOCKET 30POS 0.079 GOLD PCB Samtec Inc.	100	10.29	- + Добавить Немедленный		Tube	ESQT	Active	Elevated Socket	Forked	Board to Board or Cable	30	All	0.079 (2.00mm)	2	0.079 (2.00mm)	Through Hole	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.790 (20.07mm)	0.060 (1.52mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-
SQW-120-01-F-T CONN RCPT 60POS 0.079 GOLD PCB Samtec Inc.	100	10.29	- + Добавить Немедленный		Tube	SQW	Active	Receptacle	Forked	Board to Board or Cable	60	All	0.079 (2.00mm)	3	0.079 (2.00mm)	Through Hole	Solder	Push-Pull	Gold	3.00µin (0.076µm)	Black	0.250 (6.35mm)	0.090 (2.29mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-
ESQT-115-02-L-D-487 CONN SOCKET 30POS 0.079 GOLD PCB Samtec Inc.	3357	10.29	- + Добавить Немедленный		Bulk	ESQT	Active	Elevated Socket	Forked	Board to Board or Cable	30	All	0.079 (2.00mm)	2	0.079 (2.00mm)	Through Hole	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.487 (12.37mm)	0.363 (9.22mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-
SQW-130-01-F-D CONN RCPT 60POS 0.079 GOLD PCB Samtec Inc.	3538	10.29	- + Добавить Немедленный	Datenblatt	Tube	SQW	Active	Receptacle	Forked	Board to Board or Cable	60	All	0.079 (2.00mm)	2	0.079 (2.00mm)	Through Hole	Solder	Push-Pull	Gold	3.00µin (0.076µm)	Black	0.250 (6.35mm)	0.090 (2.29mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-
ESQT-115-02-L-D-378 CONN SOCKET 30POS 0.079 GOLD PCB Samtec Inc.	3561	10.29	- + Добавить Немедленный		Tube	ESQT	Active	Elevated Socket	Forked	Board to Board or Cable	30	All	0.079 (2.00mm)	2	0.079 (2.00mm)	Through Hole	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.378 (9.60mm)	0.472 (12.00mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-
BSW-115-24-S-D CONN RCPT 30POS 0.1 GOLD PCB Samtec Inc.	3654	10.31	- + Добавить Немедленный	Datenblatt	Bulk	BSW	Active	Receptacle, Breakaway	Female Socket	Board to Board	30	All	0.100 (2.54mm)	2	0.100 (2.54mm)	Through Hole, Bottom Mount	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.350 (8.89mm)	0.165 (4.19mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-