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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
91618-322ALF

91618-322ALF

CONN RCPT 44POS 0.1 GOLD SMD

Amphenol ICC (FCI)

 3963 6.27
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 91618-322ALF

Datenblatt

 Tape & Reel (TR) Dubox™ Active Receptacle, Bottom or Top Entry Female Socket Board to Board 44 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Gray 0.275 (6.99mm) - - UL94 V-0 Tin 10.81mm -
851-83-045-20-001101

851-83-045-20-001101

CONN SOCKET 45P 0.05 GOLD PCB RA

Preci-Dip

 3821 6.65
- +

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 851-83-045-20-001101

Datenblatt

 Bulk 851 Active Socket Female Socket Board to Board 45 All 0.050 (1.27mm) 1 - Through Hole, Right Angle Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.087 (2.20mm) 0.118 (3.00mm) -55°C ~ 125°C UL94 V-0 Tin - -
805-87-078-10-012101

805-87-078-10-012101

CONN SOCKET 78POS 0.1 GOLD PCB

Preci-Dip

 3216 6.03
- +

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 805-87-078-10-012101

Datenblatt

 Bulk 805 Active Socket Female Socket Board to Board 78 All 0.100 (2.54mm) 3 0.100 (2.54mm) Through Hole Solder Push-Pull Gold Flash Black 0.165 (4.20mm) 0.125 (3.18mm) -55°C ~ 125°C UL94 V-0 Tin - -
SSQ-132-02-T-D-RA

SSQ-132-02-T-D-RA

CONN RCPT 64POS 0.1 TIN PCB R/A

Samtec Inc.

 2616 8.92
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 SSQ-132-02-T-D-RA

Datenblatt

 Bulk SSQ Active Receptacle Forked Board to Board or Cable 64 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole, Right Angle Solder Push-Pull Tin - Black 0.195 (4.95mm) 0.100 (2.54mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESQT-103-03-G-D-346

ESQT-103-03-G-D-346

CONN SOCKET 6POS 0.079 GOLD PCB

Samtec Inc.

 3434 6.27
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 ESQT-103-03-G-D-346

Datenblatt

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 6 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.346 (8.80mm) 0.112 (2.84mm) -55°C ~ 125°C UL94 V-0 Gold - -
BSW-118-24-L-S

BSW-118-24-L-S

CONN RCPT 18POS 0.1 GOLD PCB

Samtec Inc.

 3322 6.27
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 BSW-118-24-L-S

Datenblatt

 Bulk BSW Active Receptacle, Breakaway Female Socket Board to Board 18 All 0.100 (2.54mm) 1 - Through Hole, Bottom Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.350 (8.89mm) 0.170 (4.32mm) -55°C ~ 125°C UL94 V-0 Tin - -
CLP-106-02-S-D-BE-A

CLP-106-02-S-D-BE-A

CONN RCPT 12POS 0.05 GOLD SMD

Samtec Inc.

 2307 6.27
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Немедленный

 CLP-106-02-S-D-BE-A

Datenblatt

 Tube CLP Active Receptacle, Bottom Entry Female Socket Board to Board 12 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-105-33-L-T

ESQ-105-33-L-T

CONN SOCKET 15POS 0.1 GOLD PCB

Samtec Inc.

 3568 6.27
- +

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Немедленный

 ESQ-105-33-L-T

Datenblatt

 Bulk ESQ Active Elevated Socket Forked Board to Board 15 All 0.100 (2.54mm) 3 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.635 (16.13mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-122-34-T-S

ESQ-122-34-T-S

CONN SOCKET 22POS 0.1 TIN PCB

Samtec Inc.

 2920 6.27
- +

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 ESQ-122-34-T-S

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 22 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.635 (16.13mm) 0.280 (7.11mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESQT-103-03-G-D-370

ESQT-103-03-G-D-370

CONN SOCKET 6POS 0.079 GOLD PCB

Samtec Inc.

 3894 6.27
- +

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Немедленный

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 6 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.370 (9.40mm) 0.088 (2.23mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQT-108-02-L-D-368

ESQT-108-02-L-D-368

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.

 2711 6.27
- +

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Немедленный

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.368 (9.35mm) 0.482 (12.24mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-391

ESQT-108-02-L-D-391

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.

 3873 6.27
- +

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Немедленный

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.391 (9.93mm) 0.459 (11.66mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-552

ESQT-108-02-L-D-552

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.

 3232 6.27
- +

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Немедленный

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.552 (14.02mm) 0.298 (7.57mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-675

ESQT-108-02-L-D-675

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.

 2540 6.27
- +

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Немедленный

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.675 (17.14mm) 0.175 (4.45mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-680

ESQT-108-02-L-D-680

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.

 3005 6.27
- +

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Немедленный

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.680 (17.27mm) 0.170 (4.32mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-710

ESQT-108-02-L-D-710

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.

 3405 6.27
- +

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Немедленный

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.710 (18.03mm) 0.140 (3.56mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-720

ESQT-108-02-L-D-720

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.

 2009 6.27
- +

Добавить

Немедленный

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.720 (18.30mm) 0.130 (3.30mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-760

ESQT-108-02-L-D-760

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.

 3832 6.27
- +

Добавить

Немедленный

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.760 (19.30mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-108-02-L-D-770

ESQT-108-02-L-D-770

CONN SOCKET 16POS 0.079 GOLD PCB

Samtec Inc.

 3132 6.27
- +

Добавить

Немедленный

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 16 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.770 (19.56mm) 0.080 (2.03mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQT-103-03-G-D-310

ESQT-103-03-G-D-310

CONN SOCKET 6POS 0.079 GOLD PCB

Samtec Inc.

 2165 6.27
- +

Добавить

Немедленный

 Bulk ESQT Active Elevated Socket Forked Board to Board or Cable 6 All 0.079 (2.00mm) 2 0.079 (2.00mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.310 (7.87mm) 0.148 (3.76mm) -55°C ~ 125°C UL94 V-0 Gold - -
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