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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
20021321-10050D4LF

20021321-10050D4LF

CONN RCPT 50POS 0.05 GOLD SMD

Amphenol ICC (FCI)

3528 1.28
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20021321-10050D4LF

Datenblatt

Tape & Reel (TR) Minitek127® 1.27mm Active Receptacle Female Socket Board to Board 50 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.177 (4.50mm) - -40°C ~ 105°C UL94 V-0 Tin - -
801-87-018-40-002101

801-87-018-40-002101

CONN SOCKET 18P 0.1 GOLD SMD R/A

Preci-Dip

2096 1.23
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801-87-018-40-002101

Datenblatt

Bulk 801 Active Socket Female Socket Board to Board 18 All 0.100 (2.54mm) 1 - Surface Mount, Right Angle Solder Push-Pull Gold Flash Black 0.100 (2.54mm) - -55°C ~ 125°C UL94 V-0 Tin - -
801-83-012-40-002101

801-83-012-40-002101

CONN SOCKET 12P 0.1 GOLD SMD R/A

Preci-Dip

3897 1.23
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801-83-012-40-002101

Datenblatt

Bulk 801 Active Socket Female Socket Board to Board 12 All 0.100 (2.54mm) 1 - Surface Mount, Right Angle Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.100 (2.54mm) - -55°C ~ 125°C UL94 V-0 Tin - -
ESW-101-12-G-S

ESW-101-12-G-S

CONN SOCKET 1POS GOLD PCB

Samtec Inc.

3196 1.28
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ESW-101-12-G-S

Datenblatt

Bulk ESW Active Elevated Socket Forked Board to Board 1 All - 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435 (11.05mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQ-101-23-L-S

ESQ-101-23-L-S

CONN SOCKET 1POS GOLD PCB

Samtec Inc.

2291 1.28
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ESQ-101-23-L-S

Datenblatt

Bulk ESQ Active Elevated Socket Forked Board to Board 1 All - 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.535 (13.60mm) 0.190 (4.83mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESW-102-12-L-S

ESW-102-12-L-S

CONN SOCKET 2POS 0.1 GOLD PCB

Samtec Inc.

3867 1.28
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ESW-102-12-L-S

Datenblatt

Bulk ESW Active Elevated Socket Forked Board to Board 2 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.435 (11.05mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESW-102-33-F-S

ESW-102-33-F-S

CONN SOCKET 2POS 0.1 GOLD PCB

Samtec Inc.

2462 1.28
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ESW-102-33-F-S

Datenblatt

Bulk ESW Active Elevated Socket Forked Board to Board 2 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.635 (16.13mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-103-23-T-S

ESQ-103-23-T-S

CONN SOCKET 3POS 0.1 TIN PCB

Samtec Inc.

2708 1.28
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ESQ-103-23-T-S

Datenblatt

Bulk ESQ Active Elevated Socket Forked Board to Board 3 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.535 (13.60mm) 0.190 (4.83mm) -55°C ~ 105°C UL94 V-0 Tin - -
SSM-105-L-SV

SSM-105-L-SV

CONN RCPT 5POS 0.1 GOLD SMD

Samtec Inc.

2154 1.74
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SSM-105-L-SV

Datenblatt

Tube SSM Active Receptacle, Pass Through Female Socket Board to Board or Cable 5 All 0.100 (2.54mm) 1 - Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.290 (7.37mm) - -55°C ~ 125°C - Tin - -
SQT-104-01-L-S-RA

SQT-104-01-L-S-RA

CONN RCPT 4P 0.079 GOLD PCB R/A

Samtec Inc.

2645 1.84
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SQT-104-01-L-S-RA

Datenblatt

Bulk SQT Active Receptacle Forked Board to Board or Cable 4 All 0.079 (2.00mm) 1 - Through Hole, Right Angle Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.079 (2.00mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
5-535542-3

5-535542-3

CONN RCPT 6POS 0.1 GOLD PCB

TE Connectivity AMP Connectors

2762 1.02
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5-535542-3

Datenblatt

Tube,Box AMPMODU Mod IV Active Receptacle, Bottom or Top Entry Female Socket Board to Board or Cable 6 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.265 (6.73mm) 0.130 (3.30mm) -65°C ~ 125°C UL94 V-0 Tin - -
ESS-103-TT-07

ESS-103-TT-07

CONN SOCKET 3POS 0.1 TIN PCB

Samtec Inc.

3878 1.28
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ESS-103-TT-07

Datenblatt

Bulk ESS Active Elevated Socket Female Socket Board to Board 3 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.400 (10.16mm) 0.265 (6.73mm) -55°C ~ 125°C UL94 V-0 Tin - -
BCS-103-T-S-PE-BE

BCS-103-T-S-PE-BE

CONN RCPT 3POS 0.1 TIN PCB

Samtec Inc.

3103 1.28
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BCS-103-T-S-PE-BE

Datenblatt

Bulk Tiger Claw™ BCS Active Receptacle, Pass Through Female Socket Board to Board 3 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.290 (7.37mm) 0.128 (3.25mm) -55°C ~ 125°C UL94 V-0 Tin - -
CLP-102-02-L-S

CLP-102-02-L-S

CONN RCPT 2POS 0.05 GOLD SMD

Samtec Inc.

3880 1.28
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CLP-102-02-L-S

Datenblatt

Bulk CLP Active Receptacle Female Socket Board to Board 2 All 0.050 (1.27mm) 1 - Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.084 (2.14mm) - -55°C ~ 125°C UL94 V-0 Tin - -
ESS-102-T-08

ESS-102-T-08

CONN SOCKET 2POS 0.1 GOLD PCB

Samtec Inc.

2090 1.28
- +

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Bulk ESS Active Elevated Socket Female Socket Board to Board 2 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.300 (7.62mm) 0.365 (9.27mm) -55°C ~ 125°C UL94 V-0 Tin - -
SSW-101-04-S-S

SSW-101-04-S-S

CONN RCPT 1POS GOLD PCB

Samtec Inc.

2809 1.28
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Bulk SSW Active Receptacle Forked Board to Board or Cable 1 All - 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.335 (8.51mm) 0.584 (14.83mm) -55°C ~ 125°C UL94 V-0 Tin - -
801-87-012-10-173101

801-87-012-10-173101

CONN SOCKET 12POS 0.1 GOLD PCB

Preci-Dip

3777 1.24
- +

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Немедленный

801-87-012-10-173101

Datenblatt

Bulk 801 Active Socket Female Socket Board to Board 12 All 0.100 (2.54mm) 1 - Through Hole Kinked Pin, Solder Push-Pull Gold Flash Black 0.276 (7.00mm) 0.118 (3.00mm) -55°C ~ 125°C UL94 V-0 Tin - -
147105-3

147105-3

CONN RCPT 6POS 0.1 GOLD SMD

TE Connectivity AMP Connectors

2458 1.49
- +

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147105-3

Datenblatt

Tape & Reel (TR),Cut Tape (CT),Box AMPMODU Mod IV Active Receptacle, Bottom or Top Entry Female Socket Board to Board or Cable 6 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.265 (6.73mm) - -65°C ~ 125°C - Tin-Lead - -
803-83-008-20-001101

803-83-008-20-001101

CONN SOCKET 8P 0.1 GOLD PCB R/A

Preci-Dip

2960 1.24
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803-83-008-20-001101

Datenblatt

Bulk 803 Active Socket Female Socket Board to Board 8 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole, Right Angle Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.200 (5.08mm) 0.126 (3.20mm) -55°C ~ 125°C UL94 V-0 Tin - -
414-87-216-41-134191

414-87-216-41-134191

CONN SOCKET 16POS 0.1 GOLD SMD

Preci-Dip

3427 1.24
- +

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Немедленный

Bulk 414 Active Socket Female Socket Board to Board 16 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold Flash Black 0.165 (4.20mm) - -55°C ~ 125°C UL94 V-0 Tin - -
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