Фотографии | Производитель. Часть # | Акции | Цены | А | Таблицы данных | Packaging | Series | ProductStatus | NumberofPositions | Pitch | NumberofRows | RowSpacing | Length-OverallPin | Length-Post(Mating) | Length-StackHeight | Length-Tail | MountingType | Termination | ContactFinish-Post(Mating) | ContactFinishThickness-Post(Mating) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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EW-50-11-S-D-500CONN HDR 100POS 0.1 STACK T/H |
2141 | 21.12 |
ДобавитьНемедленный |
![]() Datenblatt |
Bulk | Flex Stack, EW | Active | 100 | 0.100 (2.54mm) | 2 | 0.100 (2.54mm) | 0.930 (23.622mm) | 0.100 (2.540mm) | 0.500 (12.700mm) | 0.330 (8.382mm) | Through Hole | Solder | Gold | 30.0µin (0.76µm) |
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TW-30-07-S-D-354-125CONN BRD STACK 2.00 60POS |
2617 | 21.23 |
ДобавитьНемедленный |
Bulk | TW | Active | 60 | 0.079 (2.00mm) | 2 | 0.079 (2.00mm) | 0.752 (19.101mm) | 0.273 (6.934mm) | 0.354 (8.992mm) | 0.125 (3.175mm) | Through Hole | Solder | Gold | 30.0µin (0.76µm) | |
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TW-30-07-S-D-400-110CONN BRD STACK 2.00 60POS |
2664 | 21.23 |
ДобавитьНемедленный |
Bulk | TW | Active | 60 | 0.079 (2.00mm) | 2 | 0.079 (2.00mm) | 0.752 (19.101mm) | 0.242 (6.147mm) | 0.400 (10.160mm) | 0.110 (2.794mm) | Through Hole | Solder | Gold | 30.0µin (0.76µm) | |
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TW-30-07-S-D-500-130CONN BRD STACK 2.00 60POS |
3467 | 21.23 |
ДобавитьНемедленный |
Bulk | TW | Active | 60 | 0.079 (2.00mm) | 2 | 0.079 (2.00mm) | 0.752 (19.101mm) | 0.122 (3.099mm) | 0.500 (12.700mm) | 0.130 (3.302mm) | Through Hole | Solder | Gold | 30.0µin (0.76µm) | |
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TW-30-07-S-D-500-150CONN BRD STACK 2.00 60POS |
3343 | 21.23 |
ДобавитьНемедленный |
Bulk | TW | Active | 60 | 0.079 (2.00mm) | 2 | 0.079 (2.00mm) | 0.752 (19.101mm) | 0.102 (2.591mm) | 0.500 (12.700mm) | 0.150 (3.810mm) | Through Hole | Solder | Gold | 30.0µin (0.76µm) | |
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TW-30-07-S-D-510-090CONN BRD STACK 2.00 60POS |
2313 | 21.23 |
ДобавитьНемедленный |
Bulk | TW | Active | 60 | 0.079 (2.00mm) | 2 | 0.079 (2.00mm) | 0.752 (19.101mm) | 0.152 (3.861mm) | 0.510 (12.954mm) | 0.090 (2.286mm) | Through Hole | Solder | Gold | 30.0µin (0.76µm) | |
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TW-15-07-S-Q-410-140CONN BRD STACK 2.00 60POS |
3537 | 21.23 |
ДобавитьНемедленный |
Bulk | TW | Active | 60 | 0.079 (2.00mm) | 4 | 0.079 (2.00mm) | 0.752 (19.101mm) | 0.202 (5.131mm) | 0.410 (10.414mm) | 0.140 (3.556mm) | Through Hole | Solder | Gold | 30.0µin (0.76µm) | |
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DW-50-11-S-D-540-LLCONN HDR 100POS 0.1 STACK T/H |
2745 | 21.28 |
ДобавитьНемедленный |
![]() Datenblatt |
Bulk | Flex Stack, DW | Active | 100 | 0.100 (2.54mm) | 2 | 0.100 (2.54mm) | 0.930 (23.622mm) | 0.280 (7.112mm) | 0.540 (13.716mm) | 0.110 (2.794mm) | Through Hole | Solder | Gold | 30.0µin (0.76µm) |
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TW-30-08-S-D-395-195CONN BRD STACK 2.00 60POS |
3116 | 21.90 |
ДобавитьНемедленный |
Bulk | TW | Active | 60 | 0.079 (2.00mm) | 2 | 0.079 (2.00mm) | 0.831 (21.107mm) | 0.241 (6.121mm) | 0.395 (10.033mm) | 0.195 (4.953mm) | Through Hole | Solder | Gold | 30.0µin (0.76µm) | |
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TW-30-08-S-D-475-145CONN BRD STACK 2.00 60POS |
3346 | 21.90 |
ДобавитьНемедленный |
Bulk | TW | Active | 60 | 0.079 (2.00mm) | 2 | 0.079 (2.00mm) | 0.831 (21.107mm) | 0.211 (5.359mm) | 0.475 (12.065mm) | 0.145 (3.683mm) | Through Hole | Solder | Gold | 30.0µin (0.76µm) | |
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TW-30-08-S-D-495-150CONN BRD STACK 2.00 60POS |
3379 | 21.90 |
ДобавитьНемедленный |
Bulk | TW | Active | 60 | 0.079 (2.00mm) | 2 | 0.079 (2.00mm) | 0.831 (21.107mm) | 0.186 (4.724mm) | 0.495 (12.573mm) | 0.150 (3.810mm) | Through Hole | Solder | Gold | 30.0µin (0.76µm) | |
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TW-30-08-S-D-540-165CONN BRD STACK 2.00 60POS |
2859 | 21.90 |
ДобавитьНемедленный |
Bulk | TW | Active | 60 | 0.079 (2.00mm) | 2 | 0.079 (2.00mm) | 0.831 (21.107mm) | 0.126 (3.200mm) | 0.540 (13.716mm) | 0.165 (4.191mm) | Through Hole | Solder | Gold | 30.0µin (0.76µm) | |
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TW-30-08-S-D-625-090CONN BRD STACK 2.00 60POS |
2159 | 21.90 |
ДобавитьНемедленный |
Bulk | TW | Active | 60 | 0.079 (2.00mm) | 2 | 0.079 (2.00mm) | 0.831 (21.107mm) | 0.116 (2.946mm) | 0.625 (15.875mm) | 0.090 (2.286mm) | Through Hole | Solder | Gold | 30.0µin (0.76µm) | |
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TW-30-08-S-D-625-097CONN BRD STACK 2.00 60POS |
2217 | 21.90 |
ДобавитьНемедленный |
Bulk | TW | Active | 60 | 0.079 (2.00mm) | 2 | 0.079 (2.00mm) | 0.831 (21.107mm) | 0.109 (2.769mm) | 0.625 (15.875mm) | 0.097 (2.464mm) | Through Hole | Solder | Gold | 30.0µin (0.76µm) | |
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TW-31-07-S-D-433-100CONN BRD STACK 2.00 62POS |
2609 | 21.94 |
ДобавитьНемедленный |
Bulk | TW | Active | 62 | 0.079 (2.00mm) | 2 | 0.079 (2.00mm) | 0.752 (19.101mm) | 0.219 (5.550mm) | 0.433 (11.000mm) | 0.100 (2.540mm) | Through Hole | Solder | Gold | 30.0µin (0.76µm) | |
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4-146480-0CONN HDR 40POS 0.1 STACK T/H |
161 | 23.29 |
ДобавитьНемедленный |
![]() Datenblatt |
Bulk | AMPMODU Mod II | Active | 40 | 0.100 (2.54mm) | 1 | - | 1.430 (36.322mm) | 0.120 (3.050mm) | 1.200 (30.480mm) | 0.110 (2.800mm) | Through Hole | Solder | Tin-Lead | 100.0µin (2.54µm) |
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2012-1X04G00S/028/031/QPIN HEADER, SINGLE ROW, 4 PIN, S |
10480 | 0.57 |
ДобавитьНемедленный |
Bulk | 2012 | Active | 4 | 0.100 (2.54mm) | 1 | - | - | 0.122 (3.100mm) | - | 0.110 (2.800mm) | Through Hole | Solder | Gold | Flash | |
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BSTCM-605-D-08-GT-260-TR-P-LF.050 x .100 Header |
1500 | 0.66 |
ДобавитьНемедленный |
![]() Datenblatt |
Bag | BSTCM-6 | Active | 10 | 0.050 (1.27mm) | 2 | 0.100 (2.54mm) | 0.435 (11.049mm) | 0.175 (4.445mm) | 0.260 (6.600mm) | - | Surface Mount | Solder | Gold | 10.0µin (0.25µm) |
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2114-2X12G00S-2.8-8-17.1BPIN HEADER, DOUBLE ROW, 24 PIN |
2200 | 2200.00 |
ДобавитьНемедленный |
Bulk | 2114 | Active | 24 | 0.079 (2.00mm) | 2 | 0.079 (2.00mm) | 0.673 (17.100mm) | 0.315 (8.000mm) | 0.248 (6.300mm) | 0.110 (2.800mm) | Through Hole | Solder | Gold | ||
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2012-2X07G00S/2.8/2.3/EPIN HEADER, DOUBLE ROW, 14 PIN |
6000 | 6000.00 |
ДобавитьНемедленный |
Bulk | 2012 | Active | 14 | 0.100 (2.54mm) | 2 | 0.100 (2.54mm) | - | 0.091 (2.300mm) | - | 0.110 (2.800mm) | Through Hole | Solder | Gold |