Rectangular Connectors - Board Spacers, Stackers (Board to Board) - Element(Гонконг) Technology Co., Ltd.

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Производитель. Часть #	Акции	Цены	А	Таблицы данных	Packaging	Series	ProductStatus	NumberofPositions	Pitch	NumberofRows	RowSpacing	Length-OverallPin	Length-Post(Mating)	Length-StackHeight	Length-Tail	MountingType	Termination	ContactFinish-Post(Mating)	ContactFinishThickness-Post(Mating)
TW-05-02-T-D-216-SM-P-TR 2.00 MM FLEX STACK, FLEXIBLE BOA Samtec Inc.	3076	1.82	- + Добавить Немедленный		Tape & Reel (TR)	Flex Stack, TW	Active	10	0.079 (2.00mm)	2	0.079 (2.00mm)	0.310 (7.874mm)	0.094 (2.388mm)	0.216 (5.486mm)	-	Surface Mount	Solder	Tin	-
54112-806261150LF CONN HDR 26POS 0.100 STACK T/H Amphenol ICC (FCI)	3289	1.82	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	26	0.100 (2.54mm)	2	0.100 (2.54mm)	0.744 (18.900mm)	0.196 (4.978mm)	0.453 (11.500mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
5-146502-7 CONN HDR 14POS 0.1 STACK T/H TIN TE Connectivity AMP Connectors	3217	1.82	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	14	0.100 (2.54mm)	2	0.100 (2.54mm)	1.230 (31.242mm)	0.120 (3.050mm)	1.000 (25.400mm)	0.110 (2.800mm)	Through Hole	Solder	Tin	100.0µin (2.54µm)
6-146456-4 CONN HDR 14POS 0.1 STACK T/H TIN TE Connectivity AMP Connectors	2220	1.82	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	14	0.100 (2.54mm)	1	-	0.440 (11.176mm)	0.080 (2.032mm)	0.250 (6.350mm)	0.110 (2.800mm)	Through Hole	Solder	Tin	100.0µin (2.54µm)
54112-107241300LF CONN HDR 24POS 0.100 STACK T/H Amphenol ICC (FCI)	3446	1.82	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	24	0.100 (2.54mm)	2	0.100 (2.54mm)	0.825 (20.955mm)	0.219 (5.550mm)	0.512 (13.000mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
MW-02-03-G-D-115-095-TR CONN HDR 4POS 0.039 STACK SMD Samtec Inc.	2570	1.82	- + Добавить Немедленный		Tape & Reel (TR)	Flex Stack, MW	Active	4	0.039 (1.00mm)	2	0.039 (1.00mm)	0.210 (5.334mm)	0.095 (2.413mm)	0.115 (2.921mm)	-	Surface Mount	Solder	Gold	10.0µin (0.25µm)
MW-02-03-G-D-163-065-TR CONN HDR 4POS 0.039 STACK SMD Samtec Inc.	2513	1.82	- + Добавить Немедленный		Tape & Reel (TR)	Flex Stack, MW	Active	4	0.039 (1.00mm)	2	0.039 (1.00mm)	0.228 (5.791mm)	0.065 (1.651mm)	0.163 (4.140mm)	-	Surface Mount	Solder	Gold	10.0µin (0.25µm)
MW-02-03-G-D-170-075-TR CONN HDR 4POS 0.039 STACK SMD Samtec Inc.	2854	1.82	- + Добавить Немедленный		Tape & Reel (TR)	Flex Stack, MW	Active	4	0.039 (1.00mm)	2	0.039 (1.00mm)	0.245 (6.223mm)	0.075 (1.905mm)	0.170 (4.318mm)	-	Surface Mount	Solder	Gold	10.0µin (0.25µm)
MW-02-03-G-D-181-065-TR CONN HDR 4POS 0.039 STACK SMD Samtec Inc.	2732	1.82	- + Добавить Немедленный		Tape & Reel (TR)	Flex Stack, MW	Active	4	0.039 (1.00mm)	2	0.039 (1.00mm)	0.246 (6.248mm)	0.065 (1.651mm)	0.181 (4.597mm)	-	Surface Mount	Solder	Gold	10.0µin (0.25µm)
MW-02-03-G-D-220-065-TR CONN HDR 4POS 0.039 STACK SMD Samtec Inc.	3098	1.82	- + Добавить Немедленный		Tape & Reel (TR)	Flex Stack, MW	Active	4	0.039 (1.00mm)	2	0.039 (1.00mm)	0.285 (7.239mm)	0.065 (1.651mm)	0.220 (5.588mm)	-	Surface Mount	Solder	Gold	10.0µin (0.25µm)
5-146483-9 CONN HDR 18POS 0.1 STACK T/H TIN TE Connectivity AMP Connectors	3292	1.82	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	18	0.100 (2.54mm)	2	0.100 (2.54mm)	0.440 (11.176mm)	0.130 (3.300mm)	0.200 (5.080mm)	0.110 (2.800mm)	Through Hole	Solder	Tin	100.0µin (2.54µm)
5-146486-9 CONN HDR 18POS 0.1 STACK T/H TIN TE Connectivity AMP Connectors	3168	1.82	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	18	0.100 (2.54mm)	2	0.100 (2.54mm)	0.533 (13.538mm)	0.123 (3.124mm)	0.300 (7.620mm)	0.110 (2.800mm)	Through Hole	Solder	Tin	100.0µin (2.54µm)
146483-9 CONN HDR 18POS 0.1 STACK T/H TE Connectivity AMP Connectors	3962	1.82	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	18	0.100 (2.54mm)	2	0.100 (2.54mm)	0.440 (11.176mm)	0.130 (3.300mm)	0.200 (5.080mm)	0.110 (2.800mm)	Through Hole	Solder	Tin-Lead	100.0µin (2.54µm)
54122-110221700LF CONN HDR 22POS 0.100 STACK T/H Amphenol ICC (FCI)	2308	1.82	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	22	0.100 (2.54mm)	2	0.100 (2.54mm)	1.125 (28.575mm)	0.336 (8.534mm)	0.669 (17.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-110221000LF CONN HDR 22POS 0.100 STACK T/H Amphenol ICC (FCI)	3652	1.82	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	22	0.100 (2.54mm)	2	0.100 (2.54mm)	1.125 (28.575mm)	0.611 (15.519mm)	0.394 (10.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
6-146480-2 CONN HDR 12POS 0.1 STACK T/H TIN TE Connectivity AMP Connectors	3339	1.82	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	12	0.100 (2.54mm)	1	-	1.430 (36.322mm)	0.120 (3.050mm)	1.200 (30.480mm)	0.110 (2.800mm)	Through Hole	Solder	Tin	100.0µin (2.54µm)
1-146480-2 CONN HDR 12POS 0.1 STACK T/H TE Connectivity AMP Connectors	3736	1.82	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	12	0.100 (2.54mm)	1	-	1.430 (36.322mm)	0.120 (3.050mm)	1.200 (30.480mm)	0.110 (2.800mm)	Through Hole	Solder	Tin-Lead	100.0µin (2.54µm)
TW-06-03-L-S-355-SM CONN HDR 6POS 0.079 STACK SMD Samtec Inc.	2663	1.82	- + Добавить Немедленный	Datenblatt	Tube	Flex Stack, TW	Active	6	0.079 (2.00mm)	1	-	0.467 (11.862mm)	0.113 (2.870mm)	0.354 (8.992mm)	-	Surface Mount	Solder	Gold	10.0µin (0.25µm)
5-146475-6 CONN HDR 6POS 0.1 STACK T/H GOLD TE Connectivity AMP Connectors	2106	1.83	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	6	0.100 (2.54mm)	1	-	1.230 (31.242mm)	0.330 (8.382mm)	0.800 (20.320mm)	0.100 (2.540mm)	Through Hole	Solder	Gold	15.0µin (0.38µm)
55500-109LF CONN HDR STACK Amphenol ICC (FCI)	2541	1.83	- + Добавить Немедленный		Tape & Reel (TR)	*	Active	-	-	-	-	-	-	-	-	-	-	-	-