Rectangular Connectors - Board Spacers, Stackers (Board to Board) - Element(Гонконг) Technology Co., Ltd.

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Производитель. Часть #	Акции	Цены	А	Таблицы данных	Packaging	Series	ProductStatus	NumberofPositions	Pitch	NumberofRows	RowSpacing	Length-OverallPin	Length-Post(Mating)	Length-StackHeight	Length-Tail	MountingType	Termination	ContactFinish-Post(Mating)	ContactFinishThickness-Post(Mating)
HDWM-02-59-G-D-535-SM CONN HDR 4POS 0.05 STACK SMD Samtec Inc.	3069	1.76	- + Добавить Немедленный		Bulk	Flex Stack, HDWM	Active	4	0.050 (1.27mm)	2	0.100 (2.54mm)	1.000 (25.400mm)	0.465 (11.811mm)	0.535 (13.589mm)	-	Surface Mount	Solder	Gold	10.0µin (0.25µm)
EW-05-10-F-D-236 CONN HDR 10POS 0.1 STACK T/H Samtec Inc.	3745	1.76	- + Добавить Немедленный		Bulk	Flex Stack, EW	Active	10	0.100 (2.54mm)	2	0.100 (2.54mm)	0.830 (21.082mm)	0.264 (6.706mm)	0.236 (5.994mm)	0.330 (8.382mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
EW-05-10-F-D-395 CONN HDR 10POS 0.1 STACK T/H Samtec Inc.	3517	1.76	- + Добавить Немедленный		Bulk	Flex Stack, EW	Active	10	0.100 (2.54mm)	2	0.100 (2.54mm)	0.830 (21.082mm)	0.105 (2.667mm)	0.395 (10.033mm)	0.330 (8.382mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
HW-03-11-T-D-250-SM-A CONN HDR 6POS 0.1 STACK SMD TIN Samtec Inc.	2353	1.76	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	6	0.100 (2.54mm)	2	0.100 (2.54mm)	0.865 (21.971mm)	0.615 (15.621mm)	0.250 (6.350mm)	-	Surface Mount	Solder	Tin	-
TW-05-07-L-S-490-090 2.00 MM FLEX STACK, FLEXIBLE BOA Samtec Inc.	3212	1.76	- + Добавить Немедленный		Bulk	TW	Active	5	0.079 (2.00mm)	1	-	0.752 (19.101mm)	0.172 (4.369mm)	0.490 (12.450mm)	0.090 (2.286mm)	Through Hole	Solder	Gold	10.0µin (0.25µm)
54112-108221200LF CONN HDR 22POS 0.100 STACK T/H Amphenol ICC (FCI)	3002	1.76	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	22	0.100 (2.54mm)	2	0.100 (2.54mm)	0.925 (23.500mm)	0.358 (9.100mm)	0.472 (12.000mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-104240850LF CONN HDR 24POS 0.100 STACK T/H Amphenol ICC (FCI)	3373	1.76	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	24	0.100 (2.54mm)	2	0.100 (2.54mm)	0.660 (16.764mm)	0.205 (5.200mm)	0.335 (8.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
FW-02-05-G-D-400-200-TR CONN HDR 4POS 0.05 STACK SMD Samtec Inc.	3858	1.76	- + Добавить Немедленный	Datenblatt	Tape & Reel (TR)	Flex Stack, FW	Active	4	0.050 (1.27mm)	2	0.050 (1.27mm)	0.600 (15.240mm)	0.200 (5.080mm)	0.400 (10.160mm)	-	Surface Mount	Solder	Gold	10.0µin (0.25µm)
HW-05-15-F-D-375-SM-TR CONN HDR 10POS 0.1 STACK SMD Samtec Inc.	3174	1.76	- + Добавить Немедленный	Datenblatt	Tape & Reel (TR)	Flex Stack, HW	Active	10	0.100 (2.54mm)	2	0.100 (2.54mm)	0.565 (14.351mm)	0.190 (4.826mm)	0.375 (9.525mm)	-	Surface Mount	Solder	Gold	3.00µin (0.076µm)
98426-T13-10-214LF CONN HDR 20POS 0.079 STACK TH Amphenol ICC (FCI)	2293	1.77	- + Добавить Немедленный	Datenblatt	Box	Minitek® 2.00mm	Active	20	0.079 (2.00mm)	2	0.079 (2.00mm)	1.024 (26.000mm)	0.157 (4.000mm)	0.835 (21.200mm)	0.181 (4.600mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
98426-T13-10-222LF CONN HDR 20POS 0.079 STACK TH Amphenol ICC (FCI)	3942	1.77	- + Добавить Немедленный	Datenblatt	Box	Minitek® 2.00mm	Active	20	0.079 (2.00mm)	2	0.079 (2.00mm)	1.024 (26.000mm)	0.157 (4.000mm)	0.709 (18.000mm)	0.150 (3.800mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
146515-1 CONN HDR 10POS 0.1 STACK T/H TE Connectivity AMP Connectors	2832	1.77	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	10	0.100 (2.54mm)	2	0.100 (2.54mm)	1.230 (31.242mm)	0.098 (2.500mm)	0.812 (20.625mm)	0.320 (8.128mm)	Through Hole	Solder	Tin-Lead	100.0µin (2.54µm)
MW-02-03-G-D-125-075-TR CONN HDR 4POS 0.039 STACK SMD Samtec Inc.	2336	1.77	- + Добавить Немедленный		Tape & Reel (TR)	Flex Stack, MW	Active	4	0.039 (1.00mm)	2	0.039 (1.00mm)	0.200 (5.080mm)	0.075 (1.905mm)	0.125 (3.175mm)	-	Surface Mount	Solder	Gold	10.0µin (0.25µm)
MW-02-03-G-D-129-065-TR CONN HDR 4POS 0.039 STACK SMD Samtec Inc.	3183	1.77	- + Добавить Немедленный		Tape & Reel (TR)	Flex Stack, MW	Active	4	0.039 (1.00mm)	2	0.039 (1.00mm)	0.194 (4.928mm)	0.065 (1.651mm)	0.129 (3.277mm)	-	Surface Mount	Solder	Gold	10.0µin (0.25µm)
MW-02-03-G-D-137-065-TR CONN HDR 4POS 0.039 STACK SMD Samtec Inc.	2906	1.77	- + Добавить Немедленный		Tape & Reel (TR)	Flex Stack, MW	Active	4	0.039 (1.00mm)	2	0.039 (1.00mm)	0.202 (5.131mm)	0.065 (1.651mm)	0.137 (3.480mm)	-	Surface Mount	Solder	Gold	10.0µin (0.25µm)
54112-406261000LF CONN HDR 26POS 0.100 STACK TH Amphenol ICC (FCI)	2980	1.77	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	26	0.100 (2.54mm)	2	0.100 (2.54mm)	0.744 (18.900mm)	0.255 (6.477mm)	0.394 (10.000mm)	0.095 (2.413mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54122-409261800LF CONN HDR 26POS 0.100 STACK TH Amphenol ICC (FCI)	2183	1.77	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	26	0.100 (2.54mm)	2	0.100 (2.54mm)	1.025 (26.035mm)	0.196 (4.978mm)	0.709 (18.000mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
DW-04-15-G-D-355 CONN HDR 8POS 0.1 STACK T/H GOLD Samtec Inc.	3975	1.79	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	0.630 (16.002mm)	0.165 (4.191mm)	0.355 (9.017mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	10.0µin (0.25µm)
DW-04-15-G-D-394 CONN HDR 8POS 0.1 STACK T/H GOLD Samtec Inc.	3327	1.79	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	0.630 (16.002mm)	0.126 (3.200mm)	0.394 (10.008mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	10.0µin (0.25µm)
DW-09-14-F-S-1130 CONN HDR 9POS 0.1 STACK T/H GOLD Samtec Inc.	2708	1.79	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	9	0.100 (2.54mm)	1	-	1.430 (36.322mm)	0.190 (4.826mm)	1.130 (28.702mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)