Rectangular Connectors - Board Spacers, Stackers (Board to Board) - Element(Гонконг) Technology Co., Ltd.

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Производитель. Часть #	Акции	Цены	А	Таблицы данных	Packaging	Series	ProductStatus	NumberofPositions	Pitch	NumberofRows	RowSpacing	Length-OverallPin	Length-Post(Mating)	Length-StackHeight	Length-Tail	MountingType	Termination	ContactFinish-Post(Mating)	ContactFinishThickness-Post(Mating)
DW-08-13-F-S-905 CONN HDR 8POS 0.1 STACK T/H GOLD Samtec Inc.	2952	1.70	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	8	0.100 (2.54mm)	1	-	1.230 (31.242mm)	0.215 (5.461mm)	0.905 (22.987mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
DW-08-13-F-S-965 CONN HDR 8POS 0.1 STACK T/H GOLD Samtec Inc.	3174	1.70	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	8	0.100 (2.54mm)	1	-	1.230 (31.242mm)	0.155 (3.937mm)	0.965 (24.511mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
DW-08-16-G-S-300 CONN HDR 8POS 0.1 STACK T/H GOLD Samtec Inc.	3016	1.70	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	8	0.100 (2.54mm)	1	-	0.445 (11.303mm)	0.035 (0.889mm)	0.300 (7.620mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	10.0µin (0.25µm)
DWM-06-51-L-S-250 CONN HDR 6POS 0.05 STACK T/H Samtec Inc.	3555	1.70	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DWM	Active	6	0.050 (1.27mm)	1	-	0.410 (10.414mm)	0.040 (1.016mm)	0.250 (6.350mm)	0.120 (3.048mm)	Through Hole	Solder	Gold	10.0µin (0.25µm)
EW-04-13-F-D-500 CONN HDR 8POS 0.1 STACK T/H GOLD Samtec Inc.	2728	1.70	- + Добавить Немедленный		Bulk	Flex Stack, EW	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	1.230 (31.242mm)	0.400 (10.160mm)	0.500 (12.700mm)	0.330 (8.382mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
EW-04-13-F-D-650 CONN HDR 8POS 0.1 STACK T/H GOLD Samtec Inc.	2973	1.70	- + Добавить Немедленный		Bulk	Flex Stack, EW	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	1.230 (31.242mm)	0.250 (6.350mm)	0.650 (16.510mm)	0.330 (8.382mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
EW-04-13-F-D-715 CONN HDR 8POS 0.1 STACK T/H GOLD Samtec Inc.	2683	1.70	- + Добавить Немедленный		Bulk	Flex Stack, EW	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	1.230 (31.242mm)	0.185 (4.699mm)	0.715 (18.161mm)	0.330 (8.382mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
EW-04-13-F-D-750 CONN HDR 8POS 0.1 STACK T/H GOLD Samtec Inc.	2497	1.70	- + Добавить Немедленный		Bulk	Flex Stack, EW	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	1.230 (31.242mm)	0.150 (3.810mm)	0.750 (19.050mm)	0.330 (8.382mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
20021833-07508C1LF CONN HDR 8POS 0.050 STACK SMD Amphenol ICC (FCI)	2434	1.70	- + Добавить Немедленный	Datenblatt	Tape & Reel (TR)	Minitek127® 20021833	Active	8	0.050 (1.27mm)	2	0.050 (1.27mm)	0.480 (12.200mm)	0.157 (4.000mm)	0.295 (7.500mm)	-	Surface Mount	Solder	Gold	Flash
20021833-08508C1LF CONN HDR 8POS 0.050 STACK SMD Amphenol ICC (FCI)	2680	1.70	- + Добавить Немедленный	Datenblatt	Tape & Reel (TR)	Minitek127® 20021833	Active	8	0.050 (1.27mm)	2	0.050 (1.27mm)	0.480 (12.200mm)	0.118 (3.000mm)	0.335 (8.500mm)	-	Surface Mount	Solder	Gold	Flash
54122-120202400LF CONN HDR 20POS 0.100 STACK T/H Amphenol ICC (FCI)	2098	1.70	- + Добавить Немедленный		Bag	BERGSTIK®, MezzSelect™, Basics+	Active	20	0.100 (2.54mm)	2	0.100 (2.54mm)	1.200 (30.480mm)	0.135 (3.429mm)	0.945 (24.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-801260800LF CONN HDR 26POS 0.100 STACK T/H Amphenol ICC (FCI)	2449	1.71	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	26	0.100 (2.54mm)	2	0.100 (2.54mm)	0.480 (12.200mm)	0.044 (1.118mm)	0.315 (8.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
59202-G24-10-047LF CONN HDR STACK SMD Amphenol ICC (FCI)	3950	1.71	- + Добавить Немедленный		Bag	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
98426-G03-17-118LF CONN HDR 34POS 0.079 STACK T/H Amphenol ICC (FCI)	2404	1.71	- + Добавить Немедленный	Datenblatt	Box	Minitek® 2.00mm	Active	34	0.079 (2.00mm)	2	0.079 (2.00mm)	0.555 (14.100mm)	0.157 (4.000mm)	0.299 (7.600mm)	0.091 (2.300mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
5-146474-4 CONN HDR 4POS 0.1 STACK T/H TIN TE Connectivity AMP Connectors	2170	1.71	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	4	0.100 (2.54mm)	1	-	1.230 (31.242mm)	0.120 (3.050mm)	1.000 (25.400mm)	0.110 (2.800mm)	Through Hole	Solder	Tin	100.0µin (2.54µm)
HW-06-17-G-S-283-SM-TR CONN HDR 6POS 0.1 STACK SMD GOLD Samtec Inc.	3640	1.72	- + Добавить Немедленный	Datenblatt	Tape & Reel (TR)	Flex Stack, HW	Active	6	0.100 (2.54mm)	1	-	0.415 (10.541mm)	0.132 (3.353mm)	0.283 (7.188mm)	-	Surface Mount	Solder	Gold	10.0µin (0.25µm)
98426-G13-10-237LF CONN HDR 20POS 0.079 STACK T/H Amphenol ICC (FCI)	3687	1.72	- + Добавить Немедленный	Datenblatt	Box	Minitek® 2.00mm	Active	20	0.079 (2.00mm)	2	0.079 (2.00mm)	1.024 (26.000mm)	0.157 (4.000mm)	0.768 (19.500mm)	0.091 (2.300mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
59202-F26-20-050LF CONN HDR STACK SMD Amphenol ICC (FCI)	3515	1.72	- + Добавить Немедленный		Bag	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
54122-809161650LF CONN HDR 16POS 0.100 STACK T/H Amphenol ICC (FCI)	2516	1.72	- + Добавить Немедленный		Bag	BERGSTIK®, MezzSelect™, Basics+	Active	16	0.100 (2.54mm)	2	0.100 (2.54mm)	1.025 (26.035mm)	0.255 (6.477mm)	0.650 (16.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
76745-124-10LF CONN HDR 10POS 0.100 STACK T/H Amphenol ICC (FCI)	2035	1.72	- + Добавить Немедленный		Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	10	0.100 (2.54mm)	2	0.100 (2.54mm)	1.040 (26.416mm)	0.349 (8.865mm)	0.571 (14.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)