Rectangular Connectors - Board Spacers, Stackers (Board to Board) - Element(Гонконг) Technology Co., Ltd.

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Производитель. Часть #	Акции	Цены	А	Таблицы данных	Packaging	Series	ProductStatus	NumberofPositions	Pitch	NumberofRows	RowSpacing	Length-OverallPin	Length-Post(Mating)	Length-StackHeight	Length-Tail	MountingType	Termination	ContactFinish-Post(Mating)	ContactFinishThickness-Post(Mating)
TW-06-02-T-S-200-SM-P-TR 2.00 MM FLEX STACK, FLEXIBLE BOA Samtec Inc.	2237	1.44	- + Добавить Немедленный		Tape & Reel (TR)	Flex Stack, TW	Active	6	0.079 (2.00mm)	1	-	0.310 (7.874mm)	0.112 (2.845mm)	0.198 (5.029mm)	-	Surface Mount	Solder	Tin	-
98426-G16-07-297LF CONN HDR 14POS 0.079 STACK T/H Amphenol ICC (FCI)	2606	1.44	- + Добавить Немедленный	Datenblatt	Box	Minitek® 2.00mm	Active	14	0.079 (2.00mm)	2	0.079 (2.00mm)	1.260 (32.000mm)	0.157 (4.000mm)	1.004 (25.500mm)	0.091 (2.300mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
90599-082ULF CONN HDR 0.079 STACK T/H Amphenol ICC (FCI)	2317	1.44	- + Добавить Немедленный		Tube	Minitek® MezzSelect™, Basics+	Active	-	0.079 (2.00mm)	2	0.079 (2.00mm)	-	-	-	-	Through Hole	Solder	-	-
54122-114181450LF CONN HDR 18POS 0.100 STACK T/H Amphenol ICC (FCI)	3769	1.44	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	18	0.100 (2.54mm)	2	0.100 (2.54mm)	1.040 (26.416mm)	0.349 (8.865mm)	0.571 (14.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
98426-G10-10-188LF CONN HDR 20POS 0.079 STACK T/H Amphenol ICC (FCI)	3893	1.44	- + Добавить Немедленный	Datenblatt	Box	Minitek® 2.00mm	Active	20	0.079 (2.00mm)	2	0.079 (2.00mm)	0.831 (21.100mm)	0.157 (4.000mm)	0.575 (14.600mm)	0.091 (2.300mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
5-146456-6 CONN HDR 6POS 0.1 STACK T/H TIN TE Connectivity AMP Connectors	2158	1.32	- + Добавить Немедленный	Datenblatt	Bulk,Box	AMPMODU Mod II	Active	6	0.100 (2.54mm)	1	-	0.440 (11.176mm)	0.080 (2.032mm)	0.250 (6.350mm)	0.110 (2.800mm)	Through Hole	Solder	Tin	100.0µin (2.54µm)
59132-F38-10-127LF CONN HDR 20POS 0.079 STACK TH Amphenol ICC (FCI)	3113	1.44	- + Добавить Немедленный	Datenblatt	Bulk	Minitek® 2.00mm	Active	20	0.079 (2.00mm)	2	0.079 (2.00mm)	0.752 (19.100mm)	0.134 (3.400mm)	0.500 (12.700mm)	0.118 (3.000mm)	Through Hole	Solder	Gold	8.00µin (0.203µm)
20021832-06016T1LF CONN HDR 16POS 0.05 STACK SMD Amphenol ICC (FCI)	3088	1.44	- + Добавить Немедленный	Datenblatt	Tube	Minitek127® 20021832	Active	16	0.050 (1.27mm)	2	0.050 (1.27mm)	0.402 (10.200mm)	0.138 (3.500mm)	0.236 (6.000mm)	-	Surface Mount	Solder	Gold	Flash
0877620024 CONN HDR 12POS 0.079 STACK SMD Molex	2102	1.44	- + Добавить Немедленный	Datenblatt	Tube	Milli-Grid 87762	Active	12	0.079 (2.00mm)	2	0.079 (2.00mm)	0.813 (20.650mm)	0.262 (6.655mm)	0.453 (11.500mm)	-	Surface Mount	Solder	Gold	-
0877971200 CONN HDR 12POS 0.1 STACK T/H Molex	3245	1.44	- + Добавить Немедленный	Datenblatt	Tray	C-Grid 87797	Active	12	0.100 (2.54mm)	2	0.100 (2.54mm)	0.760 (19.300mm)	0.355 (9.017mm)	0.315 (8.000mm)	0.089 (2.261mm)	Through Hole	Solder	Gold	30.0µin (0.76µm)
54112-111121000LF CONN HDR STACK Amphenol ICC (FCI)	3920	1.45	- + Добавить Немедленный		Bag	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
DW-05-07-F-D-200 CONN HDR 10POS 0.1 STACK T/H Samtec Inc.	3863	1.45	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	10	0.100 (2.54mm)	2	0.100 (2.54mm)	0.430 (10.922mm)	0.120 (3.048mm)	0.200 (5.080mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
DW-05-07-F-D-250 CONN HDR 10POS 0.1 STACK T/H Samtec Inc.	3555	1.45	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	10	0.100 (2.54mm)	2	0.100 (2.54mm)	0.430 (10.922mm)	0.070 (1.778mm)	0.250 (6.350mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
DW-05-07-F-D-300 CONN HDR 10POS 0.1 STACK T/H Samtec Inc.	2188	1.45	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	10	0.100 (2.54mm)	2	0.100 (2.54mm)	0.430 (10.922mm)	0.020 (0.508mm)	0.300 (7.620mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
DW-10-07-F-S-200 CONN HDR 10POS 0.1 STACK T/H Samtec Inc.	2273	1.45	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	10	0.100 (2.54mm)	1	-	0.430 (10.922mm)	0.120 (3.048mm)	0.200 (5.080mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
DWM-03-61-G-S-650 CONN HDR 3POS 0.05 STACK T/H Samtec Inc.	2800	1.45	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DWM	Active	3	0.050 (1.27mm)	1	-	1.050 (26.670mm)	0.280 (7.112mm)	0.650 (16.510mm)	0.120 (3.048mm)	Through Hole	Solder	Gold	10.0µin (0.25µm)
HDWM-04-53-G-S-385 CONN HDR 4POS 0.05 STACK T/H Samtec Inc.	3184	1.45	- + Добавить Немедленный		Bulk	Flex Stack, HDWM	Active	4	0.050 (1.27mm)	1	-	0.505 (12.827mm)	-	0.385 (9.779mm)	0.120 (3.048mm)	Through Hole	Solder	Gold	10.0µin (0.25µm)
HW-03-17-S-S-325-SM CONN HDR 3POS 0.1 STACK SMD GOLD Samtec Inc.	3518	1.45	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	3	0.100 (2.54mm)	1	-	0.415 (10.541mm)	0.090 (2.286mm)	0.325 (8.255mm)	-	Surface Mount	Solder	Gold	30.0µin (0.76µm)
HW-04-08-T-S-250-SM-A CONN HDR 4POS 0.1 STACK SMD TIN Samtec Inc.	2039	1.45	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	4	0.100 (2.54mm)	1	-	0.465 (11.811mm)	0.215 (5.461mm)	0.250 (6.350mm)	-	Surface Mount	Solder	Tin	-
HW-04-09-FM-D-452-110 CONN HDR 8POS 0.1 STACK T/H Samtec Inc.	3641	1.45	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	0.730 (18.542mm)	0.168 (4.267mm)	0.452 (11.481mm)	0.110 (2.800mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)