Rectangular Connectors - Board Spacers, Stackers (Board to Board) - Element(Гонконг) Technology Co., Ltd.

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Производитель. Часть #	Акции	Цены	А	Таблицы данных	Packaging	Series	ProductStatus	NumberofPositions	Pitch	NumberofRows	RowSpacing	Length-OverallPin	Length-Post(Mating)	Length-StackHeight	Length-Tail	MountingType	Termination	ContactFinish-Post(Mating)	ContactFinishThickness-Post(Mating)
DW-05-12-F-S-715 CONN HDR 5POS 0.1 STACK T/H GOLD Samtec Inc.	3381	1.04	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	5	0.100 (2.54mm)	1	-	1.030 (26.162mm)	0.205 (5.207mm)	0.715 (18.161mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
DW-05-12-F-S-735 CONN HDR 5POS 0.1 STACK T/H GOLD Samtec Inc.	3545	1.04	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	5	0.100 (2.54mm)	1	-	1.030 (26.162mm)	0.185 (4.699mm)	0.735 (18.669mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
DW-05-12-F-S-744 CONN HDR 5POS 0.1 STACK T/H GOLD Samtec Inc.	3583	1.04	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	5	0.100 (2.54mm)	1	-	1.030 (26.162mm)	0.176 (4.470mm)	0.744 (18.898mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
DW-08-15-T-S-295 CONN HDR 8POS 0.1 STACK T/H TIN Samtec Inc.	3280	1.04	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	8	0.100 (2.54mm)	1	-	0.630 (16.002mm)	0.225 (5.715mm)	0.295 (7.493mm)	0.110 (2.794mm)	Through Hole	Solder	Tin	-
DW-08-15-TM-S-400 CONN HDR 8POS 0.1 STACK T/H TIN Samtec Inc.	3650	1.04	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	8	0.100 (2.54mm)	1	-	0.630 (16.002mm)	0.120 (3.048mm)	0.400 (10.160mm)	0.110 (2.794mm)	Through Hole	Solder	Tin	-
HDWM-03-53-L-S-280 CONN HDR 3POS 0.05 STACK T/H Samtec Inc.	2411	1.04	- + Добавить Немедленный		Bulk	Flex Stack, HDWM	Active	3	0.050 (1.27mm)	1	-	0.505 (12.827mm)	0.105 (2.667mm)	0.280 (7.112mm)	0.120 (3.048mm)	Through Hole	Solder	Gold	10.0µin (0.25µm)
EW-05-12-F-S-394 CONN HDR 5POS 0.1 STACK T/H GOLD Samtec Inc.	3107	1.04	- + Добавить Немедленный		Bulk	Flex Stack, EW	Active	5	0.100 (2.54mm)	1	-	1.030 (26.162mm)	0.306 (7.772mm)	0.394 (10.008mm)	0.330 (8.382mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
HW-02-11-F-D-250-SM CONN HDR 4POS 0.1 STACK SMD GOLD Samtec Inc.	2299	1.04	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.865 (21.971mm)	0.615 (15.621mm)	0.250 (6.350mm)	-	Surface Mount	Solder	Gold	3.00µin (0.076µm)
HW-02-11-F-D-660-SM CONN HDR 4POS 0.1 STACK SMD GOLD Samtec Inc.	2177	1.04	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.865 (21.971mm)	0.205 (5.207mm)	0.660 (16.764mm)	-	Surface Mount	Solder	Gold	3.00µin (0.076µm)
HW-02-11-F-D-710-SM CONN HDR 4POS 0.1 STACK SMD GOLD Samtec Inc.	3986	1.04	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.865 (21.971mm)	0.155 (3.937mm)	0.710 (18.034mm)	-	Surface Mount	Solder	Gold	3.00µin (0.076µm)
HW-02-11-F-D-760-SM CONN HDR 4POS 0.1 STACK SMD GOLD Samtec Inc.	3398	1.04	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.865 (21.971mm)	0.105 (2.667mm)	0.760 (19.304mm)	-	Surface Mount	Solder	Gold	3.00µin (0.076µm)
HW-02-15-L-D-334-SM CONN HDR 4POS 0.1 STACK SMD GOLD Samtec Inc.	3033	1.04	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.565 (14.351mm)	0.231 (5.867mm)	0.334 (8.484mm)	-	Surface Mount	Solder	Gold	10.0µin (0.25µm)
HW-02-11-F-D-600-SM CONN HDR 4POS 0.1 STACK SMD GOLD Samtec Inc.	2972	1.04	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.865 (21.971mm)	0.265 (6.731mm)	0.600 (15.240mm)	-	Surface Mount	Solder	Gold	3.00µin (0.076µm)
54112-108140800LF CONN HDR 14POS 0.100 STACK T/H Amphenol ICC (FCI)	3760	1.04	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	14	0.100 (2.54mm)	2	0.100 (2.54mm)	0.925 (23.500mm)	0.515 (13.081mm)	0.315 (8.000mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-108141300LF CONN HDR 14POS 0.100 STACK T/H Amphenol ICC (FCI)	3883	1.04	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	14	0.100 (2.54mm)	2	0.100 (2.54mm)	0.925 (23.500mm)	0.293 (7.450mm)	0.512 (13.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
20021831-04006T4LF CONN HDR 6POS 0.050 STACK SMD Amphenol ICC (FCI)	2137	1.04	- + Добавить Немедленный		Tube	Minitek127® 20021831	Active	6	0.050 (1.27mm)	2	0.050 (1.27mm)	0.323 (8.200mm)	0.138 (3.500mm)	0.157 (4.000mm)	-	Surface Mount	Solder	Gold	10.0µin (0.25µm)
54122-812122050LF CONN HDR 12POS 0.100 STACK T/H Amphenol ICC (FCI)	3035	1.05	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	12	0.100 (2.54mm)	2	0.100 (2.54mm)	1.325 (33.660mm)	0.398 (10.109mm)	0.807 (20.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
5-146458-8 CONN HDR 8POS 0.1 STACK T/H TIN TE Connectivity AMP Connectors	2766	1.05	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	8	0.100 (2.54mm)	1	-	0.533 (13.538mm)	0.123 (3.124mm)	0.300 (7.620mm)	0.110 (2.800mm)	Through Hole	Solder	Tin	100.0µin (2.54µm)
54111-109081405LF CONN HDR STACK Amphenol ICC (FCI)	2723	1.05	- + Добавить Немедленный		Bag	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
76745-3EF-10LF CONN HDR 10POS 0.100 STACK TH Amphenol ICC (FCI)	3318	1.05	- + Добавить Немедленный		Bag	BERGSTIK®, MezzSelect™, Basics+	Active	10	0.100 (2.54mm)	2	0.100 (2.54mm)	2.181 (55.400mm)	0.230 (5.842mm)	1.831 (46.500mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)