Rectangular Connectors - Board Spacers, Stackers (Board to Board) - Element(Гонконг) Technology Co., Ltd.

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Производитель. Часть #	Акции	Цены	А	Таблицы данных	Packaging	Series	ProductStatus	NumberofPositions	Pitch	NumberofRows	RowSpacing	Length-OverallPin	Length-Post(Mating)	Length-StackHeight	Length-Tail	MountingType	Termination	ContactFinish-Post(Mating)	ContactFinishThickness-Post(Mating)
DW-04-15-F-S-375 CONN HDR 4POS 0.1 STACK T/H GOLD Samtec Inc.	2298	0.74	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	4	0.100 (2.54mm)	1	-	0.630 (16.002mm)	0.145 (3.683mm)	0.375 (9.525mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
DW-04-15-F-S-400 CONN HDR 4POS 0.1 STACK T/H GOLD Samtec Inc.	3129	0.74	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	4	0.100 (2.54mm)	1	-	0.630 (16.002mm)	0.120 (3.048mm)	0.400 (10.160mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
DW-04-15-F-S-410 CONN HDR 4POS 0.1 STACK T/H GOLD Samtec Inc.	2752	0.74	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	4	0.100 (2.54mm)	1	-	0.630 (16.002mm)	0.110 (2.794mm)	0.410 (10.414mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
DW-04-15-F-S-413 CONN HDR 4POS 0.1 STACK T/H GOLD Samtec Inc.	2372	0.74	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	4	0.100 (2.54mm)	1	-	0.630 (16.002mm)	0.107 (2.718mm)	0.413 (10.490mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
DW-04-15-F-S-422 CONN HDR 4POS 0.1 STACK T/H GOLD Samtec Inc.	3604	0.74	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	4	0.100 (2.54mm)	1	-	0.630 (16.002mm)	0.098 (2.489mm)	0.422 (10.719mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
DW-04-17-F-S-270 CONN HDR 4POS 0.1 STACK T/H GOLD Samtec Inc.	2902	0.74	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	4	0.100 (2.54mm)	1	-	0.480 (12.192mm)	0.100 (2.540mm)	0.270 (6.858mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
HDWM-01-54-G-D-300 CONN HDR 2POS STACK T/H GOLD Samtec Inc.	3698	0.74	- + Добавить Немедленный		Bulk	Flex Stack, HDWM	Active	2	-	2	0.100 (2.54mm)	0.555 (14.097mm)	0.135 (3.429mm)	0.300 (7.620mm)	0.120 (3.048mm)	Through Hole	Solder	Gold	10.0µin (0.25µm)
EW-04-15-F-S-300 CONN HDR 4POS 0.1 STACK T/H GOLD Samtec Inc.	3786	0.74	- + Добавить Немедленный		Bulk	Flex Stack, EW	Active	4	0.100 (2.54mm)	1	-	0.630 (16.002mm)	-	0.300 (7.620mm)	0.330 (8.382mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
HW-02-11-F-S-710-SM CONN HDR 2POS 0.1 STACK SMD GOLD Samtec Inc.	3836	0.74	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	2	0.100 (2.54mm)	1	-	0.865 (21.971mm)	0.155 (3.937mm)	0.710 (18.034mm)	-	Surface Mount	Solder	Gold	3.00µin (0.076µm)
HW-02-15-T-D-250-SM CONN HDR 4POS 0.1 STACK SMD TIN Samtec Inc.	3823	0.74	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.565 (14.351mm)	0.315 (8.000mm)	0.250 (6.350mm)	-	Surface Mount	Solder	Tin	-
HW-03-15-T-S-320-SM CONN HDR 3POS 0.1 STACK SMD TIN Samtec Inc.	3605	0.74	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	3	0.100 (2.54mm)	1	-	0.565 (14.351mm)	0.245 (6.223mm)	0.320 (8.128mm)	-	Surface Mount	Solder	Tin	-
HW-03-15-T-S-350-SM CONN HDR 3POS 0.1 STACK SMD TIN Samtec Inc.	2557	0.74	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	3	0.100 (2.54mm)	1	-	0.565 (14.351mm)	0.215 (5.461mm)	0.350 (8.890mm)	-	Surface Mount	Solder	Tin	-
DW-04-17-F-S-300 .100 FLEX STACK, FLEXIBLE BOARD Samtec Inc.	3971	0.74	- + Добавить Немедленный		Bulk	Flex Stack, DW	Active	4	0.100 (2.54mm)	1	-	0.480 (12.192mm)	0.070 (1.778mm)	0.300 (7.620mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
ZW-02-15-F-D-295-099 .100 FLEX STACK, FLEXIBLE BOARD Samtec Inc.	2182	0.74	- + Добавить Немедленный		Bulk	Flex Stack, ZW	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.630 (16.002mm)	0.236 (5.994mm)	0.295 (7.493mm)	0.099 (2.515mm)	Through Hole	Solder	Gold	Flash
10132990-002TRLF CONN HDR STACK Amphenol ICC (FCI)	2997	0.74	- + Добавить Немедленный		Tape & Reel (TR)	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
54122-113082000LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	2438	0.75	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	1.339 (34.000mm)	0.431 (10.950mm)	0.787 (20.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
75970-3BAA03LF CONN HDR 3POS 0.1 STACK T/H Amphenol ICC (FCI)	3202	0.75	- + Добавить Немедленный		Tape & Reel (TR)	BERGSTIK®, MezzSelect™, Basics+	Active	3	0.100 (2.54mm)	1	-	0.363 (9.220mm)	0.091 (2.300mm)	0.200 (5.080mm)	0.073 (1.854mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54121-112071300LF CONN HDR 7POS 0.1 STACK T/H Amphenol ICC (FCI)	2696	0.75	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	7	0.100 (2.54mm)	1	-	1.325 (33.660mm)	0.693 (17.600mm)	0.512 (13.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
59202-M40-05-174LF CONN HDR 10P 0.079 STACK SMD Amphenol ICC (FCI)	3871	0.75	- + Добавить Немедленный	Datenblatt	Bulk	Minitek® 2.00mm	Active	10	0.079 (2.00mm)	2	0.079 (2.00mm)	0.764 (19.400mm)	0.079 (2.000mm)	0.685 (17.400mm)	-	Surface Mount	Solder	Tin	100.0µin (2.54µm)
5-146486-4 CONN HDR 8POS 0.1 STACK T/H TIN TE Connectivity AMP Connectors	3268	0.75	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	0.533 (13.538mm)	0.123 (3.124mm)	0.300 (7.620mm)	0.110 (2.800mm)	Through Hole	Solder	Tin	100.0µin (2.54µm)