Rectangular Connectors - Board Spacers, Stackers (Board to Board) - Element(Гонконг) Technology Co., Ltd.

English

Deutsch

Русский

Türkiye

Français

Добро пожаловать Element Technology Co., Ltd.！

+86 15361839241 +86 0755-23603516

Грузовой

Все категории

Другие категории продукции >>

Производитель. Часть #	Акции	Цены	А	Таблицы данных	Packaging	Series	ProductStatus	NumberofPositions	Pitch	NumberofRows	RowSpacing	Length-OverallPin	Length-Post(Mating)	Length-StackHeight	Length-Tail	MountingType	Termination	ContactFinish-Post(Mating)	ContactFinishThickness-Post(Mating)
DW-02-11-F-S-669 CONN HDR 2POS 0.1 STACK T/H GOLD Samtec Inc.	3417	0.44	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	2	0.100 (2.54mm)	1	-	0.930 (23.622mm)	0.151 (3.835mm)	0.669 (16.993mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
DW-02-11-F-S-670 CONN HDR 2POS 0.1 STACK T/H GOLD Samtec Inc.	2707	0.44	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	2	0.100 (2.54mm)	1	-	0.930 (23.622mm)	0.150 (3.810mm)	0.670 (17.018mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
DW-02-11-F-S-710 CONN HDR 2POS 0.1 STACK T/H GOLD Samtec Inc.	3282	0.44	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	2	0.100 (2.54mm)	1	-	0.930 (23.622mm)	0.110 (2.794mm)	0.710 (18.034mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
DW-02-11-F-S-750 CONN HDR 2POS 0.1 STACK T/H GOLD Samtec Inc.	2291	0.44	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	2	0.100 (2.54mm)	1	-	0.930 (23.622mm)	0.070 (1.778mm)	0.750 (19.050mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
DW-02-15-L-S-350 CONN HDR 2POS 0.1 STACK T/H GOLD Samtec Inc.	3610	0.44	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	2	0.100 (2.54mm)	1	-	0.630 (16.002mm)	0.170 (4.318mm)	0.350 (8.890mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	10.0µin (0.25µm)
DW-03-09-TM-S-400 CONN HDR 3POS 0.1 STACK T/H TIN Samtec Inc.	3177	0.44	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	3	0.100 (2.54mm)	1	-	0.730 (18.542mm)	0.220 (5.588mm)	0.400 (10.160mm)	0.110 (2.794mm)	Through Hole	Solder	Tin	-
DW-03-09-T-S-355 CONN HDR 3POS 0.1 STACK T/H TIN Samtec Inc.	3054	0.44	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	3	0.100 (2.54mm)	1	-	0.730 (18.542mm)	0.265 (6.731mm)	0.355 (9.017mm)	0.110 (2.794mm)	Through Hole	Solder	Tin	-
DW-03-15-T-S-330 CONN HDR 3POS 0.1 STACK T/H TIN Samtec Inc.	3739	0.44	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	3	0.100 (2.54mm)	1	-	0.630 (16.002mm)	0.190 (4.826mm)	0.330 (8.382mm)	0.110 (2.794mm)	Through Hole	Solder	Tin	-
HDWM-01-53-S-S-280 CONN HDR 1POS STACK T/H GOLD Samtec Inc.	3535	0.44	- + Добавить Немедленный		Bulk	Flex Stack, HDWM	Active	1	-	1	-	0.505 (12.827mm)	0.105 (2.667mm)	0.280 (7.112mm)	0.120 (3.048mm)	Through Hole	Solder	Gold	30.0µin (0.76µm)
HDWM-01-54-G-S-335 CONN HDR 1POS STACK T/H GOLD Samtec Inc.	2456	0.44	- + Добавить Немедленный		Bulk	Flex Stack, HDWM	Active	1	-	1	-	0.555 (14.097mm)	0.100 (2.540mm)	0.335 (8.509mm)	0.120 (3.048mm)	Through Hole	Solder	Gold	10.0µin (0.25µm)
HDWM-01-53-G-S-280 CONN HDR 1POS STACK T/H GOLD Samtec Inc.	3674	0.44	- + Добавить Немедленный		Bulk	Flex Stack, HDWM	Active	1	-	1	-	0.505 (12.827mm)	0.105 (2.667mm)	0.280 (7.112mm)	0.120 (3.048mm)	Through Hole	Solder	Gold	10.0µin (0.25µm)
75970-7AY-04LF CONN HDR 4POS 0.100 STACK TH Amphenol ICC (FCI)	3003	0.44	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	1	-	0.913 (23.200mm)	0.339 (8.600mm)	0.236 (6.000mm)	0.339 (8.600mm)	Through Hole	Solder	-	-
54121-802050800LF CONN HDR 5POS 0.1 STACK T/H Amphenol ICC (FCI)	3992	0.44	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	5	0.100 (2.54mm)	1	-	0.531 (13.500mm)	0.096 (2.450mm)	0.315 (8.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
5-146502-1 CONN HDR 2POS STACK T/H TIN TE Connectivity AMP Connectors	2951	0.45	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	2	-	2	0.100 (2.54mm)	1.230 (31.242mm)	0.120 (3.050mm)	1.000 (25.400mm)	0.110 (2.800mm)	Through Hole	Solder	Tin	100.0µin (2.54µm)
54122-106040950RLF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	2779	0.45	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.744 (18.900mm)	0.250 (6.350mm)	0.374 (9.500mm)	0.120 (3.050mm)	Through Hole	Kinked Pin, Solder	Gold, GXT™	30.0µin (0.76µm)
54112-408061500LF CONN HDR 6POS 0.1 STACK T/H Amphenol ICC (FCI)	3040	0.45	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	6	0.100 (2.54mm)	2	0.100 (2.54mm)	0.925 (23.500mm)	0.239 (6.071mm)	0.591 (15.000mm)	0.095 (2.413mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
5-146455-3 CONN HDR 3POS 0.1 STACK T/H TIN TE Connectivity AMP Connectors	2866	0.46	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	3	0.100 (2.54mm)	1	-	0.440 (11.176mm)	0.130 (3.300mm)	0.200 (5.080mm)	0.110 (2.800mm)	Through Hole	Solder	Tin	100.0µin (2.54µm)
54122-402100800LF CONN HDR 10POS 0.100 STACK TH Amphenol ICC (FCI)	3207	0.42	- + Добавить Немедленный	Datenblatt	Bulk,Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	10	0.100 (2.54mm)	2	0.100 (2.54mm)	0.531 (13.500mm)	0.096 (2.450mm)	0.315 (8.000mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54122-414081400LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	3440	0.46	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	1.040 (26.416mm)	0.369 (9.373mm)	0.551 (14.000mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54122-406061050LF CONN HDR 6POS 0.1 STACK T/H Amphenol ICC (FCI)	3578	0.46	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	6	0.100 (2.54mm)	2	0.100 (2.54mm)	0.745 (18.923mm)	0.211 (5.359mm)	0.413 (10.500mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)