Sockets for ICs, Transistors - Element(Гонконг) Technology Co., Ltd.

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Производитель. Часть #	Акции	Цены	А	Таблицы данных	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
116-93-210-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3547	19.75	- + Добавить Немедленный		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
126-93-636-41-003000 CONN IC DIP SOCKET 36POS GOLD Mill-Max Manufacturing Corp.	3309	19.75	- + Добавить Немедленный	Datenblatt	Tube	126	Active	DIP, 0.6 (15.24mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-636-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3906	19.75	- + Добавить Немедленный	Datenblatt	Tube	126	Active	DIP, 0.6 (15.24mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-93-652-41-005000 CONN IC DIP SOCKET 52POS GOLD Mill-Max Manufacturing Corp.	2329	19.75	- + Добавить Немедленный	Datenblatt	Tube	117	Active	DIP, 0.6 (15.24mm) Row Spacing	52 (2 x 26)	0.070 (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.070 (1.78mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-91-318-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3604	19.76	- + Добавить Немедленный		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
104-13-950-41-780000 CONN IC DIP SOCKET 50POS GOLD Mill-Max Manufacturing Corp.	2302	19.76	- + Добавить Немедленный	Datenblatt	Tube	104	Active	DIP, 0.9 (22.86mm) Row Spacing	50 (2 x 25)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Thermoplastic
104-13-952-41-770000 CONN IC DIP SOCKET 52POS GOLD Mill-Max Manufacturing Corp.	2699	19.78	- + Добавить Немедленный	Datenblatt	Tube	104	Active	DIP, 0.9 (22.86mm) Row Spacing	52 (2 x 26)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Thermoplastic
35-0501-20 CONN SOCKET SIP 35POS TIN Aries Electronics	2589	19.79	- + Добавить Немедленный	Datenblatt	Bulk	501	Active	SIP	35 (1 x 35)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	-	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
35-0501-30 CONN SOCKET SIP 35POS TIN Aries Electronics	2847	19.79	- + Добавить Немедленный	Datenblatt	Bulk	501	Active	SIP	35 (1 x 35)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	-	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
116-43-310-61-007000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2468	19.79	- + Добавить Немедленный		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
116-93-310-61-007000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3800	19.79	- + Добавить Немедленный		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
612-41-950-41-004000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	3597	19.80	- + Добавить Немедленный	Datenblatt	Tube	612	Active	DIP, 0.9 (22.86mm) Row Spacing	50 (2 x 25)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-950-41-004000 SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp.	2584	19.80	- + Добавить Немедленный	Datenblatt	Tube	612	Active	DIP, 0.9 (22.86mm) Row Spacing	50 (2 x 25)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-306-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2127	19.81	- + Добавить Немедленный		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
116-93-306-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2885	19.81	- + Добавить Немедленный		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
110-43-308-61-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2042	19.81	- + Добавить Немедленный		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
110-93-308-61-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3555	19.81	- + Добавить Немедленный		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
116-93-650-41-001000 CONN IC DIP SOCKET 50POS GOLD Mill-Max Manufacturing Corp.	3652	19.81	- + Добавить Немедленный	Datenblatt	Tube	116	Active	DIP, 0.6 (15.24mm) Row Spacing	50 (2 x 25)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-650-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3591	19.81	- + Добавить Немедленный	Datenblatt	Tube	116	Active	DIP, 0.6 (15.24mm) Row Spacing	50 (2 x 25)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-950-41-001000 SOCKET CARRIER SLDRTL .900 50POS Mill-Max Manufacturing Corp.	3003	19.82	- + Добавить Немедленный	Datenblatt	Tube	612	Active	DIP, 0.9 (22.86mm) Row Spacing	50 (2 x 25)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester