Rectangular Connectors - Headers, Receptacles, Female Sockets - Element(Гонконг) Technology Co., Ltd.

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Производитель. Часть #	Акции	Цены	А	Таблицы данных	Packaging	Series	ProductStatus	ConnectorType	ContactType	Style	NumberofPositions	NumberofPositionsLoaded	Pitch-Mating	NumberofRows	RowSpacing-Mating	MountingType	Termination	FasteningType	ContactFinish-Mating	ContactFinishThickness-Mating	InsulationColor	InsulationHeight	ContactLength-Post	OperatingTemperature	MaterialFlammabilityRating	ContactFinish-Post	MatedStackingHeights	IngressProtection
TLE-125-01-G-DV-A-K-TR CONN RCPT 50POS 0.079 GOLD SMD Samtec Inc.	2599	9.01	- + Добавить Немедленный	Datenblatt	Tape & Reel (TR),Cut Tape (CT)	TLE	Active	Receptacle, Pass Through	Female Socket	Board to Board or Cable	50	All	0.079 (2.00mm)	2	0.079 (2.00mm)	Surface Mount	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.177 (4.50mm)	-	-55°C ~ 125°C	-	-	-	-
ESW-111-44-S-D CONN SOCKET 22POS 0.1 GOLD PCB Samtec Inc.	2057	9.01	- + Добавить Немедленный	Datenblatt	Tube	ESW	Active	Elevated Socket	Forked	Board to Board	22	All	0.100 (2.54mm)	2	0.100 (2.54mm)	Through Hole	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.735 (18.67mm)	0.180 (4.57mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-
ESW-112-34-G-D CONN SOCKET 24POS 0.1 GOLD PCB Samtec Inc.	3010	9.01	- + Добавить Немедленный	Datenblatt	Tube	ESW	Active	Elevated Socket	Forked	Board to Board	24	All	0.100 (2.54mm)	2	0.100 (2.54mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.635 (16.13mm)	0.280 (7.11mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-
ESW-114-13-S-D CONN SOCKET 28POS 0.1 GOLD PCB Samtec Inc.	2880	9.01	- + Добавить Немедленный	Datenblatt	Tube	ESW	Active	Elevated Socket	Forked	Board to Board	28	All	0.100 (2.54mm)	2	0.100 (2.54mm)	Through Hole	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.435 (11.05mm)	0.290 (7.37mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-
ESW-130-13-L-S CONN SOCKET 30POS 0.1 GOLD PCB Samtec Inc.	3367	9.01	- + Добавить Немедленный	Datenblatt	Tube	ESW	Active	Elevated Socket	Forked	Board to Board	30	All	0.100 (2.54mm)	1	-	Through Hole	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.435 (11.05mm)	0.290 (7.37mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-
ESQ-111-39-G-D CONN SOCKET 22POS 0.1 GOLD PCB Samtec Inc.	2198	9.03	- + Добавить Немедленный	Datenblatt	Tube	ESQ	Active	Elevated Socket	Forked	Board to Board	22	All	0.100 (2.54mm)	2	0.100 (2.54mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.435 (11.05mm)	0.480 (12.19mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-
ESQ-110-59-G-D CONN SOCKET 20POS 0.1 GOLD PCB Samtec Inc.	2888	9.03	- + Добавить Немедленный	Datenblatt	Tube	ESQ	Active	Elevated Socket	Forked	Board to Board	20	All	0.100 (2.54mm)	2	0.100 (2.54mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.635 (16.13mm)	0.280 (7.11mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-
ESQ-111-34-G-D CONN SOCKET 22POS 0.1 GOLD PCB Samtec Inc.	3845	9.03	- + Добавить Немедленный	Datenblatt	Tube	ESQ	Active	Elevated Socket	Forked	Board to Board	22	All	0.100 (2.54mm)	2	0.100 (2.54mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.635 (16.13mm)	0.280 (7.11mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-
SL-119-G-10 CONN RCPT .100 19POS GOLD PCB Samtec Inc.	2561	9.06	- + Добавить Немедленный		Bulk	SL	Active	Receptacle	Female Socket	Board to Board	19	All	0.100 (2.54mm)	1	-	Through Hole	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.122 (3.10mm)	0.108 (2.75mm)	-55°C ~ 125°C	-	-	-	-
SSM-118-S-SH CONN RCPT .100 18POS SNGL HORZ Samtec Inc.	3271	9.06	- + Добавить Немедленный		Tube	SSM	Active	Receptacle	Female Socket	Board to Board or Cable	18	All	0.100 (2.54mm)	1	-	Surface Mount, Right Angle	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.125 (3.18mm)	-	-55°C ~ 125°C	-	Tin	-	-
FLE-119-01-G-DV-A-K CONN RCPT 38POS 0.05 GOLD SMD Samtec Inc.	2671	9.06	- + Добавить Немедленный	Datenblatt	Tube	FLE	Active	Receptacle	Female Socket	Board to Board or Cable	38	All	0.050 (1.27mm)	2	0.050 (1.27mm)	Surface Mount	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.172 (4.37mm)	-	-55°C ~ 125°C	-	Gold	-	-
HIF3FB-60DA-2.54DSA(71) CONN RCPT 60POS 0.1 GOLD PCB Hirose Electric Co Ltd	2942	9.06	- + Добавить Немедленный	Datenblatt	Tray	HIF3FB	Active	Receptacle	Female Socket	Board to Board or Cable	60	All	0.100 (2.54mm)	2	0.100 (2.54mm)	Through Hole	Solder	Push-Pull	Gold	8.00µin (0.203µm)	Black	0.374 (9.50mm)	0.118 (3.00mm)	-55°C ~ 85°C	UL94 V-0	Tin	12.2mm	-
ESW-136-12-T-D CONN SOCKET 72POS 0.1 TIN PCB Samtec Inc.	3543	9.06	- + Добавить Немедленный	Datenblatt	Tube	ESW	Active	Elevated Socket	Forked	Board to Board	72	All	0.100 (2.54mm)	2	0.100 (2.54mm)	Through Hole	Solder	Push-Pull	Tin	-	Black	0.435 (11.05mm)	0.090 (2.29mm)	-55°C ~ 105°C	UL94 V-0	Tin	-	-
SSW-129-02-S-S-RA CONN RCPT .100 29POS R/A SGL AU Samtec Inc.	3701	9.08	- + Добавить Немедленный		Bulk	SSW	Active	Receptacle	Forked	Board to Board or Cable	29	All	0.100 (2.54mm)	1	-	Through Hole, Right Angle	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.095 (2.41mm)	0.100 (2.54mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-
HLE-113-02-G-DV-BE-A-P CONN RCPT 26POS 0.1 GOLD SMD Samtec Inc.	3875	9.08	- + Добавить Немедленный		Tube	HLE	Active	Receptacle, Bottom Entry	Female Socket	Board to Board	26	All	0.100 (2.54mm)	2	0.100 (2.54mm)	Surface Mount	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.144 (3.66mm)	-	-55°C ~ 125°C	-	Gold	-	-
ESW-115-12-S-D CONN SOCKET 30POS 0.1 GOLD PCB Samtec Inc.	2275	9.08	- + Добавить Немедленный	Datenblatt	Tube	ESW	Active	Elevated Socket	Forked	Board to Board	30	All	0.100 (2.54mm)	2	0.100 (2.54mm)	Through Hole	Solder	Push-Pull	Gold	30.0µin (0.76µm)	Black	0.435 (11.05mm)	0.090 (2.29mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-
ESQ-107-24-G-T CONN SOCKET 21POS 0.1 GOLD PCB Samtec Inc.	3749	9.08	- + Добавить Немедленный	Datenblatt	Tube	ESQ	Active	Elevated Socket	Forked	Board to Board	21	All	0.100 (2.54mm)	3	0.100 (2.54mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.535 (13.60mm)	0.380 (9.65mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-
ESQ-115-38-L-D CONN SOCKET 30POS 0.1 GOLD PCB Samtec Inc.	3919	9.08	- + Добавить Немедленный	Datenblatt	Tube	ESQ	Active	Elevated Socket	Forked	Board to Board	30	All	0.100 (2.54mm)	2	0.100 (2.54mm)	Through Hole	Solder	Push-Pull	Gold	10.0µin (0.25µm)	Black	0.435 (11.05mm)	0.290 (7.37mm)	-55°C ~ 125°C	UL94 V-0	Tin	-	-
ESW-114-23-G-D CONN SOCKET 28POS 0.1 GOLD PCB Samtec Inc.	2347	9.08	- + Добавить Немедленный	Datenblatt	Tube	ESW	Active	Elevated Socket	Forked	Board to Board	28	All	0.100 (2.54mm)	2	0.100 (2.54mm)	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.535 (13.60mm)	0.190 (4.83mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-
ESQ-118-44-G-S CONN SOCKET 18POS 0.1 GOLD PCB Samtec Inc.	3981	9.08	- + Добавить Немедленный	Datenblatt	Tube	ESQ	Active	Elevated Socket	Forked	Board to Board	18	All	0.100 (2.54mm)	1	-	Through Hole	Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.735 (18.67mm)	0.180 (4.57mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-